WMSIC Electronic Components

MSKSEMI 1N4007WS-MS 1N4007WS

Model1N4007WS-MS
PackageSOD-323
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI 1N4007WS-MS
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
1N4007WS-MS
Electronic Component
1
Package
SOD-323
Electronic Component
General Purpose Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0257677019
Current
1A
Diode
1
Current(Ir)
5uA@1000V
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N4007WS-MS 产品概述

一、产品简介

1N4007WS-MS 是美森科(MSKSEMI)推出的一款小型表面贴装整流二极管,采用SOD-323封装,属于独立式单个二极管器件。器件基于硅整流设计,具备高达1kV的直流反向耐压,整流电流额定为1A,能够满足多数中低功率整流及保护应用的需求。

二、主要特性

  • 单个独立二极管,便于点对点替换与电路布局
  • 直流反向耐压(Vr):1000 V
  • 额定整流电流(IF):1 A(连续)
  • 非重复峰值浪涌电流(Ifsm):15 A(短时冲击)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装形式:SOD-323,适合高密度贴片组装

三、电气与热性能要点

该器件在常温及典型工况下适用于单相整流、续流与反向保护等用途。15A的峰值浪涌能力适用于短时浪涌事件(例如通电瞬间的浪涌电流),但不宜长期以此电流工作。SOD-323为小型封装,热阻较大,长期1A工作时需重视PCB散热设计与降额使用,以保证结温在安全范围内。

四、封装与安装说明

SOD-323为小体积贴片封装,适配自动贴片生产。推荐注意事项:

  • 采用合适的焊盘与热释散铜箔,增大焊盘面积以改善散热。
  • 回流焊工艺应控制峰值温度与时间,避免超出封装耐受范围。
  • 存储与搬运避免潮湿,必要时按行业湿敏等级(MSL)处理并烘烤。

五、典型应用场景

  • 开关电源与整流模块的小功率输出端
  • 逆极保护与反向电压屏蔽
  • 通用家电与工业控制中的低至中等电流整流
  • 电池充放电路径的保护与旁路电路

六、使用建议与可靠性

  • 在设计中考虑热降额:对于连续1A工作,建议在PCB上提供足够散热面积或采用更大铜厚。
  • 峰值浪涌15A为短时能力,若应用存在频繁大浪涌,建议选择更高浪涌额定或并联/保护电路。
  • 工作环境温度及结温应控制在器件允许范围内,长期高温会降低寿命与可靠性。
  • 在高压应用中注意隔离与爬电距离,尽管器件耐压高,但系统设计需满足安全规范。

总结:1N4007WS-MS 将传统1N4007的高耐压特性与SOD-323小型贴片形式相结合,适合在空间受限且需高耐压的整流或保护电路中使用。合理的热管理与浪涌保护设计能显著提升器件在实际应用中的稳定性与寿命。

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