WMSIC Electronic Components

MSKSEMI HT7350-1-MS HT7350

ModelHT7350-1-MS
PackageSOT-89
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI HT7350-1-MS
Type
MSKSEMI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
60mV@(40mA)
Electronic Component
MSKSEMI
Electronic Component
HT7350-1-MS
Electronic Component
1
Package
SOT-89
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.137g
Electronic Component
1
Electronic Component
BM0225765440
Operating Temperature
35℃~+80℃@(Ta)
Operating Voltage
24V
Output
Electronic Component
Output Voltage
5V
Output Current
300mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT7350-1-MS 产品概述

HT7350-1-MS 是 MSKSEMI(美森科)推出的一款小体积、低静态电流的固定输出线性稳压器,输出为正极 5V,单通道设计,适用于对噪声和纹波敏感且待机功耗要求严格的低功耗系统。

一、主要特性

  • 输出类型:固定(5.0V 正输出)
  • 工作电压:最高可达 24V 输入
  • 输出电流:最大 300mA(短时可承受峰值,长期使用需关注热耗散)
  • 压差(Dropout):60mV @ 40mA(低压差设计,有利于低压差应用)
  • 静态电流(Iq):典型 1.5μA,适合电池供电与待机优化场景
  • 工作温度范围:-35℃ ~ +80℃(Ta)
  • 输出极性:正极输出
  • 输出通道数:1 路
  • 封装:SOT-89,体积小,便于空间受限的电路板布局

二、规格亮点与性能说明

  • 超低静态电流:1.5μA 的静态电流显著降低系统待机功耗,适合长时间待机或电池供电设备。
  • 低压差表现:60mV@40mA 的压差在中小电流工况下能提高系统效率,但需注意随负载电流增大压差会上升。
  • 中等输出能力:300mA 的输出能力满足多数数码、小功率模块和传感器供电需求,但在高输入电压与高负载电流时须考虑热量管理。

三、典型应用场景

  • 便携式与电池供电设备(对待机功耗敏感)
  • 低噪声模拟电路、传感器供电、MCU 及外围电路稳压
  • 工业控制与家电中的辅助电源(在热量可控范围内)
  • 嵌入式系统的局部 5V 低功耗稳压需求

四、使用建议与注意事项

  • 输出电容:为保证稳压器稳定与瞬态响应,建议在输出侧靠近稳压器放置低 ESR 的旁路电容(常用 1μF10μF 陶瓷或钽电容,具体请参照器件手册)。输入侧宜加 0.1μF1μF 陶瓷去耦。
  • 热设计:线性稳压器的功耗等于 (Vin − Vout) × Iout。当输入为 24V、输出 5V 且负载接近 300mA 时,器件功耗约为 5.7W,SOT-89 封装在 PCB 上的散热能力有限,可能导致过热或热关断。建议在高 Vin 或大电流工况下采取加大铜箔散热面积、使用散热垫或改用开关型降压器。
  • 工作环境:器件给出的工作温度为 -35℃~+80℃(Ta),实际使用时需考虑功耗导致的芯片结温上升,必要时进行温度裕量评估。
  • 引脚与封装:SOT-89 小封装适合空间受限电路板,但引脚功能和封装尺寸请以厂家数据手册为准,设计 PCB 时注意引脚布局与散热铺铜。

五、封装与采购

  • 品牌:MSKSEMI(美森科)
  • 型号:HT7350-1-MS
  • 封装形式:SOT-89,便于波峰/回流焊装配
  • 采购建议:用于量产前请索取并核对最新数据手册与样品,按应用场景评估热设计与外部元件选型,必要时与供应商沟通批量供货与质量保证事宜。

总结:HT7350-1-MS 以其超低静态电流与低压差特性,适合低功耗、对噪声要求较高的 5V 稳压场合。但在高输入电压与高负载电流条件下需重视热管理,必要时采用降压转换器或改进散热设计。欲获得完整技术参数、典型特性曲线与封装引脚图,请参阅官方数据手册。

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