WMSIC Electronic Components

MSKSEMI MFP6291LR-G1 MFP6291LR

ModelMFP6291LR-G1
PackageSOT-23-6
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI MFP6291LR-G1
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
MFP6291LR-G1
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.041g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230826850
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.2V~16V
Switching Frequency
1.2MHz
Electronic Component
Electronic Component
Output Current
2.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MFP6291LR-G1 产品概述

一、特性概述

MFP6291LR-G1 是一款升压型开关稳压器,适用于从较低电压升压到可调输出的单路电源设计。器件集成了开关管(内置),工作电压范围宽(2.2V~16V),开关频率高(1.2MHz),静态电流仅 100µA,空载待机损耗低,适合电池供电或低功耗系统。器件为非同步整流(需外部整流二极管),最大输出电流可达 2.5A,工作温度范围 -40℃~+85℃(TA)。

二、主要电气参数(关键项)

  • 功能类型:升压型(Boost)
  • 输入电压范围:2.2V ~ 16V
  • 输出电流:最大 2.5A(负载能力)
  • 开关频率:1.2MHz(典型)
  • 静态电流(Iq):约 100µA
  • 同步整流:否(需外置肖特基二极管)
  • 输出通道数:1 路,可调输出
  • 开关管:内置
  • 拓扑结构:升压式
  • 工作温度:-40℃ ~ +85℃(环境温度)
  • 封装:SMB (DO-214AA)
  • 品牌:MSKSEMI (美森科)

三、典型应用场景

  • 便携式电子设备(移动电源、手持终端)需要从单节电池升压到更高电压的场合
  • LED 驱动(中高功率 LED 的恒流/升压前级)
  • 显示驱动或外围模拟电源(需可调输出电压)
  • 工业或汽车低压系统的升压电源(留意工作温度及输入范围)
  • 低功耗待机场合,受益于低静态电流

四、设计与选型要点

  • 外部整流:由于为非同步整流架构,必须选用低 Vf 的肖特基二极管。二极管反向耐压应大于目标输出电压并留裕量,平均/反复脉冲电流能力应 ≥ 额定输出电流的 1.2~2×。
  • 电感选择:建议按期望电流纹波 ΔIL(通常取 20%~40% 的 Iout)计算电感: L = Vin * (Vout − Vin) / (ΔIL * fsw * Vout) 由于开关频率为 1.2MHz,可选用体积较小的高频电感,需保证电感的饱和电流高于峰值电流。
  • 电容选择:输入/输出电容采用低 ESR、低 ESL 的陶瓷或聚合物电容,确保能承受开关纹波和回路峰值电流。输出电容容量与 ESR 将直接影响输出纹波和瞬态响应。
  • 稳定与补偿:若芯片外部需要补偿网络,请根据器件参考设计和应用要求调整,确保系统稳定。
  • 效率考量:非同步整流在高电流或大升压比下效率会下降,需综合考虑散热与效率权衡。在高负载工况下加强散热设计或评估同步方案替代。

五、布局与散热建议

  • 布局要点:将开关管、二极管、输入电容和电感形成的电流回路面积尽量压缩;输入电容应靠近芯片 VIN 引脚布置;输出电容靠近输出端口放置,减小回路寄生。
  • 地平面:采用大面积接地平面以降低寄生阻抗并利于散热。
  • 热管理:SMB 封装具有一定的功耗承载能力,但在高输出电流或高升压比下会产生较多热量。需要在 PCB 上做散热铜箔、热盲孔或加装散热片,确保芯片在允许温度范围内工作。
  • EMI 考虑:高开关频率有利于减小被动元件体积,但需做好输入/输出滤波和走线屏蔽以降低电磁干扰。

六、封装与采购信息

  • 封装形式:SMB (DO-214AA),适合中等功率应用并利于散热处理。
  • 品牌与型号:MSKSEMI(美森科) MFP6291LR-G1
  • 工作环境:工业级温度范围 -40℃ ~ +85℃(TA),适应一般工业与消费类应用。购买与设计前建议参阅厂方完整数据手册,确认引脚定义、典型应用电路及各类保护特性(如过流、过热保护)以便完成可靠设计。

如需基于具体输入/输出条件(例如 Vin、Vout、负载特性)做参考电路、电感/二极管与滤波元件的具体选型计算,可提供参数,我将给出详细计算与元件推荐。

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