WMSIC Electronic Components

MSKSEMI AT8236-MS AT8236

ModelAT8236-MS
PackageESOP-8
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI AT8236-MS
Type
MSKSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
AT8236-MS
Electronic Component
1
Package
ESOP-8
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.098g
Electronic Component
1
Integrated FET
Electronic Component
H
1
Features
Current Sampling
Electronic Component
BM0257677018
Resistor
260mΩ
Current
3.6A
Operating Temperature
40℃~+125℃
Operating Voltage
6.5V~40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT8236-MS 产品概述

一、产品概览

AT8236-MS 是美森科(MSKSEMI)推出的一款单通道 H 桥马达/负载驱动器,内部集成功率 FET,适用于 6.5V 至 40V 的宽工作电压范围。器件采用 ESOP-8 封装,峰值驱动电流可达 3.6A,低静态电流(Iq = 15µA),通过 PWM 接口实现转速或方向控制,专为空间受限且需高效率、低待机功耗的电机与电感性负载驱动场景设计。

二、主要规格与特性

  • 工作电压:6.5V ~ 40V,兼容 12V/24V 车载与工业供电系统
  • 峰值电流:3.6A(注意连续电流需依据散热条件判定)
  • 导通电阻:Rds(on) = 260 mΩ(单个 FET)
  • 静态电流:Iq = 15 µA,低功耗待机性能优越
  • 接口:PWM 输入用于速度/占空比控制,支持方向/制动控制信号(参考具体引脚定义)
  • 封装:ESOP-8,便于在紧凑板级布局中使用
  • 工作温度:-40 ℃ ~ +125 ℃,满足车规级与工业级温度要求

三、典型应用场景

  • 小型直流减速电机驱动(玩具、家电、便携设备)
  • 汽车车窗、座椅或镜子调整类轻负载驱动
  • 执行器、步进系统的单通道驱动器或半桥驱动拓扑
  • 工业自动化中要求低待机电流与宽压特性的控制模块

四、设计与布局建议

  • 电源与接地:在 VCC 入口处放置低 ESR 的电解或固态电容(如 10–100 µF)与 0.1 µF 陶瓷并联,靠近器件引脚布局,抑制瞬态电流和振铃。
  • 散热:Rds(on)=260 mΩ 在高电流时会产生显著功耗(P≈I^2·R),例如 2A 连续时单 FET 损耗约 1.04W,需评估 PCB 铜箔面积和底部散热通孔;ESOP-8 热焊盘应焊接良好以降低结温。
  • 布线:大电流回路走宽线或多走线,缩短高电流路径,避免噪声耦合到 PWM/控制信号。
  • 抗浪涌与抑制:对车载或工业环境建议在输入侧加 TVS 和合适的浪涌抑制器,负载感性回路可利用器件内置本体二极管,但仍推荐外部箝位或 RC 闭环网络以保护器件并降低 EMI。
  • PWM 使用:选择合适的 PWM 频率以在开关损耗与电机噪声间折衷(常见范围数 kHz 至几十 kHz);避免在极低占空比下长时间运行以防止不稳定工作点。

五、使用注意事项

  • 峰值电流 3.6A 为短时能力,连续电流应根据 PCB 散热能力、环境温度和器件温度额定进行热工计算并留裕量。
  • 启动与关断应考虑升压/浪涌,必要时采用软启动或限流策略。
  • 在高温或高负载条件下注意频繁热循环可能影响可靠性,建议在系统设计中留有温度监测或保护机制。
  • 参考厂商数据手册获取引脚定义、绝对最大额定值及典型应用电路,按推荐布局与外围元件值设计以确保稳定性与可靠性。

总结:AT8236-MS 以集成 FET 的 H 桥结构、宽输入电压、低待机电流及适度峰值电流,适合要求体积小、功耗低且适应车载/工业电源环境的轻载电机与执行器应用。正确的 PCB 散热与抑制措施是获得长期可靠运行的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.