WMSIC Electronic Components

MSKSEMI AT8870-MS AT8870

ModelAT8870-MS
PackageESOP-8
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI AT8870-MS
Type
MSKSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
AT8870-MS
Electronic Component
1
Package
ESOP-8
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.114g
Electronic Component
1
Integrated FET
Electronic Component
H
1
Features
Current Sampling
Electronic Component
BM0264464018
Resistor
520mΩ
Current
3.6A
Operating Temperature
40℃~+125℃
Static Current(Iq)
15uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT8870-MS 集成FET单H桥驱动器产品概述

一、产品核心定位

AT8870-MS是一款集成内部场效应管(FET)的单H桥驱动器,专为小体积、低功耗、宽温环境下的负载控制设计。其整合H桥拓扑与功率FET,无需外部功率器件即可实现单路负载的双向驱动或切换,有效简化电路设计、降低系统成本与体积,适合对功耗、空间敏感的工业及消费类应用场景。

二、关键参数解析

  1. 集成FET设计:内置功率MOSFET,无需外部添加功率管,减少元件数量与PCB空间占用,提升电路可靠性。
  2. 单H桥拓扑:支持单路负载的双向驱动(如直流电机正反转)或单极性切换,满足基础负载控制需求。
  3. 峰值电流能力:峰值输出电流可达3.6A,可应对小型负载的瞬时启动电流(如小电机启动、电磁阀吸合)。
  4. 低导通电阻:内部FET导通电阻仅520mΩ,导通损耗低,工作时发热小,常规功率需求下无需额外散热设计。
  5. 超低静态功耗:静态电流(Iq)仅15μA,待机状态下功耗极低,特别适合电池供电的便携式设备,延长电池续航时间。
  6. 宽温工作范围:支持-40℃至+125℃的工作温度区间,符合工业级环境要求,可稳定应用于高低温极端场景。

三、封装与可靠性设计

AT8870-MS采用ESOP-8封装,属于小型化贴片封装,引脚间距合理,便于PCB布线与自动化贴装,适合高密度电路设计。封装工艺成熟,具备良好的热传导性能,配合低导通电阻可有效降低工作温度,提升长期可靠性。此外,宽温范围设计使其在户外、工业现场等恶劣环境下仍能稳定工作,减少温度变化导致的性能波动。

四、典型应用场景

  1. 小型直流电机驱动:如智能家居窗帘电机、玩具电机、小型打印头电机等,支持正反转控制,满足基础运动需求。
  2. 电池供电设备负载切换:便携式医疗设备、手持仪器的负载电源切换,低静态电流可延长电池使用时间。
  3. 小型电磁阀/继电器驱动:工业自动化中的微型电磁阀、低压继电器驱动,峰值电流可满足吸合需求。
  4. LED驱动与调光:小功率LED阵列的切换或调光控制,低导通电阻可降低LED驱动损耗。

五、品牌与品质保障

AT8870-MS由MSKSEMI(美森科) 出品,该品牌专注功率半导体器件研发,产品经过严格可靠性测试(温度循环、湿度老化、电应力测试等),符合工业级标准。其封装与参数一致性好,批量应用稳定性可靠,为系统设计提供扎实支撑。

该器件以“小体积+低功耗+宽温”为核心优势,覆盖多类基础负载驱动场景,是简化电路设计、提升系统性价比的实用选择。

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