WMSIC Electronic Components

MSKSEMI LM2596S-ADJ-MS LM2596S

ModelLM2596S-ADJ-MS
PackageTO-263-5L
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI LM2596S-ADJ-MS
Type
MSKSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
LM2596S-ADJ-MS
Electronic Component
1
Package
TO-263-5L
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.06g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0225765412
Operating Temperature
40℃~+125℃@(TA)
Operating Voltage
4.5V~40V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2596S-ADJ-MS 产品概述

一、产品简介

LM2596S-ADJ-MS 为降压型开关稳压器,内置开关管,单路输出、可调型设计。工作输入电压范围宽(4.5V~40V),输出电压可调(约1.2V~37V),最大输出电流3A,开关频率约150kHz。器件静态电流约5mA,工作温度范围-40℃至+125℃(TA),封装为TO-263-5L,品牌:MSKSEMI(美森科)。该器件不采用同步整流,需外接肖特基二极管进行整流与回流路径设计。

二、主要特点

  • 宽输入电压:4.5V~40V,适用于12V/24V及更高直流母线场合;
  • 可调输出:1.2V~37V,支持低压核心供电及中高压电源输出;
  • 大电流能力:最高3A输出,适合中功率负载;
  • 内置开关管:简化外围设计,节省板上面积;
  • 中等开关频率:150kHz,在效率与外设尺寸之间取得平衡;
  • 低静态电流:约5mA,有助于轻载下降低耗电;
  • 非同步整流:需外接肖特基二极管,选择电流/电压裕量合适的型号。

三、典型应用场景

  • 工业控制电源(24V母线降压);
  • 汽车电子(经稳压后的附件电源,需注意瞬态与抑制);
  • 通信设备、仪表和嵌入式系统的局部供电;
  • 电池管理与便携设备的升/降压结合系统中的降压段。

四、设计要点与建议

  • 整流二极管:由于为非同步整流,建议选用额定电压高于系统最大输入、平均/脉冲电流≥3A 的低压降肖特基二极管;
  • 电感选择:选择饱和电流高于3A、直流电阻尽量小的电感;感量按占空比和允许纹波电流选择,常见为几十微亨到数百微亨范围;
  • 输入/输出电容:输入端要求低ESR大电容以抑制开关噪声,输出端需低ESR电解或钽电容配合陶瓷滤波以降低输出纹波与稳定反馈环路;
  • 反馈设置:输出通过电阻分压到ADJ端,可参考内部参考压约1.23V,用公式 Vout = Vref*(1+R2/R1) 计算并注意ADJ端偏置电流影响;
  • 板级布局:高频回路(VIN–开关–肖特基–Cout)走线最短、闭环最紧密;输入电容靠近器件VIN脚,肖特基靠近开关节点布局;散热铜箔与器件散热引脚良好连接以利散热。

五、热管理与可靠性

在高Vin与高Iout条件下,器件和周边器件会产生较大损耗。建议根据实际功率损耗评估散热需求:采用较大散热焊盘、热孔通到内层/背面铜,以及必要时加装散热片或风冷。工作环境高温时应适当降额使用以保证长期可靠性。

六、封装与采购提示

TO-263-5L 封装便于板上散热与高电流焊接。采购时确认MSKSEMI(美森科)版本的引脚定义与参考设计,与目标系统的输入范围和器件替代兼容性;同时为非同步整流版本,需同时备配合适的肖特基二极管和外部电感器件。

以上为LM2596S-ADJ-MS 的产品概述与设计参考,便于快速评估在具体电源方案中的可用性与注意事项。若需典型电路图、外围元件选型表或热阻计算示例,可提供具体工作点(Vin、Vout、Iout)以便精确计算与推荐。

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