WMSIC Electronic Components

MSKSEMI AZC199-04S-MS AZC199

ModelAZC199-04S-MS
PackageSOT-23-6
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI AZC199-04S-MS
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
AZC199-04S-MS
Electronic Component
1
Package
SOT-23-6
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.015g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.5pF;0.8pF
Electronic Component
BM0264520868
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AZC199-04S-MS 四路ESD防护器件产品概述

AZC199-04S-MS是美森科电子(MSKSEMI) 推出的一款四路单向ESD防护器件,专为敏感电子电路的静电放电(ESD)、电快速瞬变脉冲群(EFT)及浪涌(Surge)干扰防护设计,采用SOT-23-6小封装,兼顾高密度布局与高性能防护,适用于消费电子、IoT设备等多类小型化产品。

一、核心电气参数解析

该器件的关键电气参数精准匹配低功耗、高频信号场景的防护需求:

  • 极性与工作电压:单向防护设计,反向截止电压(Vrwm)为5V,确保正常工作时反向不导通,不干扰电路功能;击穿电压约6V,接近工作电压范围,可快速触发防护机制。
  • 脉冲耐受能力:峰值脉冲电流(Ipp)达5A,峰值脉冲功率(Ppp)为100W,能有效应对典型ESD浪涌事件(如接触放电±8kV、空气放电±15kV)。
  • 钳位与漏电流:ESD触发时钳位电压稳定在15V以内,将后端电路电压限制在安全范围;反向漏电流(Ir)仅1μA,极小的漏电流不影响电路正常功耗与信号传输。
  • 低结电容特性:结电容(Cj)范围为0.5pF~0.8pF,远低于普通防护器件,对高频信号(如USB、HDMI等高速数据接口)的传输损耗可忽略,保障信号完整性。

二、防护性能与标准认证

AZC199-04S-MS通过多项国际电磁兼容(EMC)标准认证,防护能力覆盖三类常见干扰:

  • ESD防护:符合IEC 61000-4-2标准,可抵御接触放电(最高±8kV)与空气放电(最高±15kV),避免静电对芯片、传感器等敏感元件的击穿或软失效。
  • EFT与浪涌防护:同时满足IEC 61000-4-4(电快速瞬变脉冲群)及IEC 61000-4-5(浪涌)标准,能抑制电源或信号线上的快速脉冲干扰与浪涌冲击,提升设备稳定性。
  • 四路集成通道:单器件集成四路独立防护通道,可同时为多路信号或电源线路提供防护,简化电路设计,减少PCB上的器件数量与布线复杂度。

三、封装与适用场景

  • 封装优势:采用SOT-23-6贴片封装,尺寸紧凑(典型尺寸约2.9×1.6×1.1mm),适配高密度PCB布局,尤其适合小型化电子设备的空间限制。
  • 典型应用场景:
    1. 消费电子:智能手机、平板电脑、无线耳机的USB接口、音频接口、充电端口防护;
    2. IoT设备:智能家居控制器、传感器节点、智能穿戴设备的信号/电源线路防护;
    3. 小型电子模块:车载小模块(如胎压监测、车载USB)、工业传感器模块的抗干扰防护。

四、产品应用优势总结

AZC199-04S-MS在防护性能与设计灵活性上具备显著优势:

  • 多通道集成:四路防护减少器件数量,降低BOM成本与PCB空间占用;
  • 低电容兼容高频:0.5pF~0.8pF结电容不影响高速数据传输,适配USB 2.0/3.0、HDMI等接口;
  • 宽标准覆盖:单器件满足ESD、EFT、浪涌三类干扰防护,简化EMC设计流程;
  • 小封装易集成:SOT-23-6封装适合自动化贴装,提升生产效率;
  • 低漏电流:1μA反向漏电流不影响电路正常工作,尤其适合低功耗设备。

综上,AZC199-04S-MS是一款高性价比的多路ESD防护器件,可有效提升敏感电子设备的抗干扰能力与可靠性,适配多类小型化、高频化的电子产品需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.