WMSIC Electronic Components

MSKSEMI MSAD8605ARTZ-REEL7 MSAD8605ARTZ

ModelMSAD8605ARTZ-REEL7
PackageSOT-23-5
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI MSAD8605ARTZ-REEL7
Type
MSKSEMI
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
MSAD8605ARTZ-REEL7
Electronic Component
1
Package
SOT-23-5
Electronic Component
Operational Amplifier
Electronic Component
0.045g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0264595663
Operating Temperature
40℃~+85℃
Amplifier
1
Output Current
26mA
(SR)
6V/us
Power Supply Voltage
2.2V~5.5V
Static Current(Iq)
510uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSAD8605ARTZ-REEL7 精密运算放大器产品概述

一、产品定位与品牌背书

MSAD8605ARTZ-REEL7是美森科(MSKSEMI) 推出的单路精密运算放大器,定位于低功耗、小封装、轨到轨I/O 的信号调理场景,针对便携式设备、工业传感器、医疗仪器等对尺寸、功耗及精度有双重要求的应用领域。美森科作为专注模拟半导体的厂商,其产品以高可靠性和性能稳定性著称,该型号延续了品牌在精密运放领域的技术积累,适配主流工业级及消费级应用需求。

二、核心性能参数全面解析

该运放的关键参数覆盖精度、带宽、功耗、抗干扰等核心维度,具体如下:

  • 电源适应性:支持单电源(2.2V5.5V)与双电源(±1.1V±2.75V)工作,最大电源电压差(Vdd-Vss)达5.5V,灵活适配不同供电系统;
  • 精度指标:输入失调电压(Vos)2.5mV,失调电压温漂600nV/℃,输入失调电流(Ios)5pA,满足中等精度信号放大需求;
  • 动态性能:增益带宽积(GBP)8MHz,压摆率(SR)6V/μs,可处理100kHz以下中高频信号;
  • 噪声与抗干扰:1kHz处噪声密度8nV/√Hz,共模抑制比(CMRR)95dB,有效抑制环境噪声与共模干扰;
  • 功耗与输出:静态电流(Iq)仅510μA,输出电流达26mA,兼顾低功耗与负载驱动能力;
  • 环境与封装:工作温度-40℃~+85℃(工业级),封装为SOT-23-5(超小型5脚表面贴装)。

三、关键技术特性深度解读

1. 全轨到轨输入输出设计

该型号采用轨到轨输入(Rail-to-Rail Input)与轨到轨输出(Rail-to-Rail Output),输入信号可覆盖电源轨95%以上范围(单电源0VVdd,双电源-VeeVcc),输出同样能驱动至接近电源轨的电压。例如单电源2.2V供电时,输入0.1V或2.1V仍能线性放大,输出可达到2.15V以上,彻底解决传统运放“信号截止”问题,大幅提升信号动态范围。

2. 超低输入偏置电流

10pA的输入偏置电流(Ib)远低于普通通用运放(通常nA级),能直接匹配高阻抗传感器(如压电传感器、光电二极管、高阻应变片),无需额外添加射极跟随器或阻抗变换电路,简化系统设计的同时降低噪声引入。

3. 低噪声与中带宽平衡

8MHz的GBP与8nV/√Hz的噪声密度实现了“带宽-噪声”的合理平衡:既满足100kHz以下中低频信号的放大需求(如工业压力传感器的动态输出),又通过低噪声设计保障μV级弱信号的检测精度,适合医疗设备(如血糖监测仪的光电信号)等场景。

4. 低功耗与小封装适配

510μA的静态电流使其成为电池供电设备的理想选择(如可穿戴健康监测仪、手持万用表),单节锂电池(3.7V)供电时可连续工作数十小时;SOT-23-5封装尺寸仅约2.9mm×2.6mm,能有效节省PCB空间,适配便携式设备的小型化设计。

四、封装与工作环境要求

  • 封装形式:SOT-23-5(超小型表面贴装),引脚定义符合行业标准(1-输出、2-反相输入、3-同相输入、4-Vss/Vee、5-Vdd/Vcc),便于PCB布局;
  • 工作温度:-40℃~+85℃(工业级),可稳定工作于户外、车间等温差较大的环境,无需额外散热设计;
  • 存储与包装:常规半导体存储要求(-55℃~+150℃,湿度≤60%),Reel7包装适合自动化贴装生产。

五、典型应用场景梳理

结合参数特性,该运放的核心应用场景包括:

  1. 便携式医疗设备:血糖监测仪、脉搏血氧仪、小型心电图机(弱信号放大+低功耗);
  2. 工业传感器调理:压力、温度、位移传感器的信号放大(高阻抗匹配+抗干扰);
  3. 电池供电手持设备:手持万用表、便携式示波器、环境监测仪(低功耗+小封装);
  4. 音频前置放大:便携式耳机放大器、麦克风前置放大(低噪声+轨到轨);
  5. 有源滤波器:低通/高通滤波器(8MHz带宽满足中高频滤波需求)。

六、市场竞争优势总结

相比同级别通用精密运放,MSAD8605ARTZ-REEL7的核心优势在于:

  • 性能-尺寸-功耗平衡:小封装+低功耗+轨到轨I/O,适配便携式设备的严苛要求;
  • 高阻抗输入能力:10pA偏置电流解决高阻传感器匹配问题,简化系统设计;
  • 工业级可靠性:-40℃~+85℃工作温度,满足工业现场应用;
  • 成本效益:美森科成熟工艺保障性能稳定,同时控制成本,适合量产。

该型号通过精准的参数设计,覆盖了从消费级到工业级的多场景需求,是便携式设备与精密信号调理领域的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.