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MSKSEMI BTA41-800BRG-MS BTA41
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MSKSEMI BTA41-800BRG-MS
- Type
- MSKSEMI
- Minimum package
- 30 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MSKSEMI
- Electronic Component
- BTA41-800BRG-MS
- Electronic Component
- 1
- Package
- TOP-3
- Electronic Component
- Thyristor (SCR) / Module
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0264677473
- Operating Temperature
- 40℃~+125℃
- Surge Current
- 400A@50Hz
- Thyristor Type
- 1 Thyristor
- Latching Current(Ih)
- 80mA
- Current(It)
- 40A
- Electronic Component
- Electronic Component
- Electronic Component
- 30
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BTA41-800BRG-MS 产品概述
一、产品简介
BTA41-800BRG-MS 是美森科（MSKSEMI）推出的一款双向可控硅（Triac），采用可靠的 TO-3（TOP-3）金属封装设计。器件额定反向/正向可阻断峰值电压达 800V，额定通态电流 40A，具备出色的热稳定性与抗过载能力，适用于中高功率交流开关与相位控制场合。
二、主要参数
- 可控硅类型：双向可控硅（Triac）
- 断态峰值电压 Vdrm：800V
- 额定通态电流 It：40A
- 浪涌电流：400A（@50Hz）
- 门极平均耗散功率 PG(AV)：1W
- 通态峰值电压 Vtm：1.5V
- 门极触发电流 Igt：70mA
- 门极触发电压 Vgt：1.3V
- 保持电流 Ih：80mA
- 工作温度范围：-40℃ ～ +125℃
- 封装：TOP-3（金属壳，便于散热）
三、主要特性与优势
- 高耐压（800V），适用于高电压交流系统与工业级电源管理；
- 额定通流能力 40A，瞬态浪涌承受能力强（400A@50Hz），对负载突变与启动电流有良好鲁棒性；
- TO-3 金属封装有利于热量传导与散热，配合合适散热器可长期稳定工作；
- 门极触发参数适中（Igt≈70mA、Vgt≈1.3V），便于常规驱动电路直接触发，但需保证门极驱动电流充足；
- 低通态压降（Vtm≈1.5V）降低导通损耗，有利于提升系统效率与减少热应力。
四、典型应用场景
- 家用电器：电机软启动、温控器、洗衣机与空调的相位调节；
- 工业自动化：交流负载开关、加热器控制、速度调节与功率整流；
- 照明控制：调光器、舞台灯光与大功率照明系统；
- 电力调节与电源管理：交流功率调节单元、稳压与保护电路等。
五、封装与使用建议
- 建议将器件牢固安装在适配的散热器上，并使用良好的导热垫或导热膏以降低结壳热阻；
- 门极驱动应能提供至少大于 Igt 的触发电流，并考虑门极保护（抗干扰与限流）以防误触发或器件损伤；
- 在可能出现高 dv/dt 的场合，建议配合 RC 抑制网络（缓冲/吸收）以提高抗干扰能力并延长寿命；
- 设计时注意环境温度对额定电流的降额效应，必要时留有余量并进行热仿真验证。
六、选型与注意事项
- 若系统存在较大启动浪涌或频繁重复过载，需校核器件的脉冲承受能力并考虑更高浪涌等级或并联方案；
- 门极保持电流 Ih≈80mA，设计时确保负载在低电流区仍能维持可控硅导通；
- 对于高可靠性应用，建议结合器件的温度特性曲线与实际散热条件进行寿命评估。
总结：BTA41-800BRG-MS 以其高压耐受、良好通流与金属封装散热特性，适合各种中高功率交流控制应用。选用时应重视门极驱动与散热设计，以确保长期稳定运行。
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