WMSIC Electronic Components

MICRONE ME6119C50M5G

ModelME6119C50M5G
PackageSOT-23-5
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME6119C50M5G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
104mV@(100mA)
Electronic Component
MICRONE
Electronic Component
ME6119C50M5G
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0226539369
Operating Temperature
40℃~+125℃@(Ta)
Operating Voltage
18V
Output
Electronic Component
Output Voltage
5V
Output Current
400mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME6119C50M5G — 5V 固定输出低压差线性稳压器(LDO)

一、概述

ME6119C50M5G 是南京微盟(MICRONE)推出的一款 5V 固定输出低压差线性稳压器,采用 SOT-23-5 小封装。器件支持使能控制,并内置短路保护、过流保护和热关断功能,适合对噪声和纹波有较高要求且空间受限的电源管理场景。

二、主要特点

  • 输出类型:固定(5.0V)正极输出
  • 最大输出电流:400 mA
  • 低压差:104 mV @ 100 mA(低压差利于电池工作点)
  • 静态电流(Iq):60 μA(适合低功耗应用)
  • 带使能(EN)功能,支持外部开/关控制(具体控制电平请参考规格书)
  • 保护功能:短路保护、过流保护、热关断(提高系统可靠性)
  • 工作电压上限:18 V
  • 工作温度范围:-40 ℃ ~ +125 ℃(Ta)
  • 封装:SOT-23-5

三、电气与热性能要点

  • 低压差特性使器件在输入电压接近输出电压时仍能维持稳压,适合电池或低压轨供电场合。
  • 静态电流 60 μA,有利于待机/休眠功耗控制。
  • 在高 Vin 与高 Iout 情况下,芯片功耗 Pd ≈ (Vin − Vout) × Iout,需关注封装功耗能力与 PCB 散热设计。例如:若 Vin = 12V、Vout = 5V、Iout = 100 mA,则 Pd = 0.7 W;若 Iout = 400 mA,Pd 可达 2.8 W,SOT-23-5 封装下需加强铜箔散热或改用降压方案。

四、封装与引脚

  • 封装:SOT-23-5,适合空间受限的应用板级安装。
  • 常见引脚包括 VIN、VOUT、GND、EN(使能),以及一功能或接地引脚。为避免误接或功能错误,建议以官方数据手册为准确认引脚定义和布局建议。

五、典型应用与布局建议

  • 典型应用:便携设备、传感器节点、嵌入式系统、单板微控制器供电、工业控制模块等。
  • 输出电容:为保证稳定性与瞬态响应,建议在靠近 VOUT 放置低 ESR 陶瓷电容(如 1 μF–10 μF,X5R/X7R);输入端亦应加去耦电容(1 μF 或更大),并缩短电容到器件引脚的走线。
  • 热管理:高差压或大电流时采用较大铜箔、热过孔或者外接散热体;必要时考虑用开关降压转换器以降低芯片功耗。

六、选型与注意事项

  • 在高 Vin 且需持续大电流输出场合,优先评估器件散热能力或采用开关稳压后辅以 LDO 精密线性稳压。
  • 使能引脚逻辑、电容值与 ESR 要求、短路恢复行为等请参照官方规格书以获得精确参数和典型应用电路。
  • 若需替代或并联使用,应考虑热与保护特性的一致性。

如需该器件的详细电气特性曲线、引脚图与典型电路图,可提供数据手册以便进一步分析和设计建议。

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