Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICRONE MEM2307XG
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICRONE MEM2307XG
- Type
- MICRONE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICRONE
- Electronic Component
- MEM2307XG
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0227695472
- Power Dissipation(Pd)
- 1.4W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
- Capacitor(Ciss)
- 700pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MEM2307XG 产品概述
一、概述
MEM2307XG 是 MICRONE（南京微盟）推出的一款 P 沟道场效应管（P‑MOSFET），封装为 SOT‑23，面向低电压电源管理与高侧开关应用。器件耐压 30V，连续漏极电流可达 4.1A，适用于便携设备和板载电源开关场合，兼顾导通性能与封装尺寸的折衷。
二、关键参数（典型/标称）
- 漏源耐压 Vdss：30V
- 连续漏极电流 Id：4.1A
- 导通电阻 RDS(on)：88 mΩ @ 10V（测量条件见数据表）
- 阈值电压 Vgs(th)：1.3V（典型）
- 栅极电荷 Qg：14.3 nC @ 4.5V
- 输入电容 Ciss：700 pF；输出电容 Coss：120 pF；反向传输电容 Crss：75 pF
- 功耗 Pd（封装相关）：约 1.4W（参考值，受 PCB 散热影响较大）
- 封装：SOT‑23（小体积，适合空间受限的应用）
三、特点与优势
- 小封装：SOT‑23 适合空间受限的便携式和消费电子产品。
- 低 RDS(on)：在较高栅压下具有较低导通电阻，有利于降低导通损耗。
- 中等栅极电荷与电容：Qg 与 Ciss 指标处于中等水平，对栅极驱动要求合理，适合开关频率不超高的场景。
- 适用高侧开关：P 沟道布局便于实现高侧断开控制，减少外部驱动复杂度。
四、典型应用场景
- 电池/电源高侧开关与负载断电控制
- 便携式设备（智能终端、电源管理模块）
- 反接/倒灌保护电路（与限流元件配合）
- 低中功率开关电源中的备用回路或热插拔控制
五、设计与使用建议
- 开关连接：P‑MOSFET 源极接入电源正 rail，漏极到负载，高侧控制时门极拉低导通，拉高回到源电位使其关断。
- 栅极驱动：因 Qg≈14.3 nC（@4.5V）且 Ciss≈700 pF，在需要较快开关时应考虑合适的驱动能力或阻尼网络，避免因充放电时间造成的开关损耗和振铃。
- 热设计：SOT‑23 的 Pd 受 PCB 铜箔和焊盘影响较大，实际功耗应按 PCB 热阻和环境温度进行热耦合计算并适当降额使用。
- 布线与去耦：减短功率回路走线以降低寄生电感；在 MOSFET 近侧放置足够的去耦电容以抑制瞬态电压尖峰。
- 安全余量：实际设计中应查阅完整数据手册以获取最大 Vgs、脉冲电流、热阻等限制，并留有裕量以保证可靠性。
六、选型注意事项
- 若目标为更高开关频率或更低导通损耗，请同时比较导通电阻在目标 Vgs 下的变化以及总开关损耗（与 Qg、Coss 有关）。
- 对于更高电流或更严格热管理的场合，应优先考虑更大封装或低 RDS(on) 的器件。
- 在关键设计中建议参考并测试器件在实际 PCB 和温度条件下的表现，确保满足系统可靠性要求。
如需基于 MEM2307XG 的参考电路、封装引脚图或更详细的温度/电流特性，请提供具体的应用场景与工作条件，我可以进一步给出电路建议与热设计计算。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
