WMSIC Electronic Components

MICRONE ME3148ASPG

ModelME3148ASPG
PackageESOP-8
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME3148ASPG
Type
MICRONE
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME3148ASPG
Electronic Component
1
Package
ESOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.173g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227651507
Operating Temperature
40℃~+85℃
Operating Voltage
8V~36V
Switching Frequency
160kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME3148ASPG 产品概述

一、产品简介

ME3148ASPG 是南京微盟(MICRONE)推出的一款降压型 DC-DC 开关稳压器,采用降压拓扑并集成功率开关管,封装为 ESOP-8。器件适配宽输入电压范围,输出可调并支持同步整流,面向需要高效率、体积紧凑的中小功率稳压场合。

二、主要参数

  • 功能类型:降压型(Buck)
  • 工作电压:8V ~ 36V
  • 输出电压:1.25V ~ 33V(可调)
  • 输出电流:最大 3A
  • 开关频率:160 kHz
  • 静态电流(Iq):约 2 mA
  • 同步整流:是(内置同步 MOSFET)
  • 开关管:内置
  • 输出通道数:1
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:ESOP-8

三、功能与特色

  • 宽输入电压范围,适合汽车、工业与电池供电场景。
  • 内置高效同步整流开关,降低整流损耗,提高在中高负载时的效率。
  • 低静态电流有利于轻载及待机功耗控制。
  • 可调输出覆盖 1.25V 起,便于为各类芯片和模块提供稳压电源。
  • ESOP-8 封装兼顾散热与 PCB 布局便利性。

四、典型应用

  • 汽车电子与车载附件(需确认额外汽车级认证)
  • 工业控制电源、传感器供电模块
  • 通信设备、路由器与交换机电源
  • 电池管理与便携设备中间母线降压

五、设计要点与建议

  • 输出电压通常由外部分压网络设定,参考基准近似 1.25V,使用高精度电阻以降低误差。
  • 开关频率 160kHz,计算电感 L 时可用公式:L = (Vin − Vout)·Vout / (Vin·ΔI·fs),建议电感电流纹波率 ΔI 取 20%~40% 的额定输出电流。
  • 输入与输出电容需选用低 ESR 类型,输入电容靠近器件 VIN-GND 布局以抑制尖峰电流。
  • PCB 布局注意将高电流回路尽量缩短、增大铜箔,地线单点回流并做好散热过孔或散热铜区处理。
  • 在高温或高负载场景关注热降额,必要时加散热板或并联散热路径。

六、封装与热管理

ESOP-8 提供较好的导热路径,建议在 PCB 下方设计大面积接地铜皮与过孔以提升热传导;保证器件工作温度在 -40 ℃~+85 ℃ 范围内以维持长期可靠性。

七、可靠性与注意事项

在实际设计中应做短路、过温、启动上电顺序等验证;为保证稳定性,按数据手册选择反馈回路补偿和外围元件。若用于汽车或严格工业环境,应进一步确认认证与长期老化测试结果。

如需典型应用电路、外围器件选型示例或 PCB 布局参考图,我可提供进一步资料与计算支持。

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