WMSIC Electronic Components

MICRONE ME2808A30M3G

ModelME2808A30M3G
PackageSOT-23
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2808A30M3G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2808A30M3G
Electronic Component
1
Package
SOT-23
Electronic Component
Supervisorand positions IC
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0227604916
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
1.5V~18V
ICType
Voltage Detector
Output Type
Electronic Component
Voltage
3V
Static Current(Iq)
1.8uA
Supervisor Voltage
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2808A30M3G 产品概述

一、概述

ME2808A30M3G 是南京微盟(MICRONE)推出的一款单路电压检测器,主要用于监控电源电压并在电压低于阈值时输出复位信号。器件采用 SOT-23 小封装,工作电压范围宽(1.5V–18V),静态电流极小(Iq = 1.8 μA),非常适合电池供电及待机功耗敏感的便携设备与工业终端。输出为开漏(open-drain),复位为低电平有效,无看门狗与手动复位功能,监控通道数为 1,阈值电压为 3.0V,工作温度范围 -40℃ ~ +85℃(Ta)。

二、主要特性

  • 品牌:MICRONE(南京微盟)
  • 芯片类型:电压检测器(监测单路电压)
  • 输出类型:开漏(open-drain),低电平有效复位
  • 监控阈值:3.0V(阈值电压)
  • 工作电压:1.5V ~ 18V,适配多种系统电源
  • 静态电流:典型 1.8 μA,适合超低功耗设计
  • 温度范围:-40℃ ~ +85℃(Ta)
  • 封装:SOT-23(小尺寸,便于表面贴装)

三、典型应用场景

  • 电池供电的消费类设备(如便携仪器、手持终端)
  • 工业控制与嵌入式系统的电源看护
  • 单片机(MCU)复位电路与上电复位(POR)功能
  • 需要低待机功耗与可靠复位的智能传感器节点

四、设计建议与注意事项

  • 由于输出为开漏,请在复位链路上加上上拉电阻至系统逻辑电平(常见值 10 kΩ 左右,根据上拉速度和噪声抗扰要求调整)。
  • 若需延长复位脉冲或抗瞬态干扰,可在复位输出与地之间外接 RC 电路或使用上拉电阻与电容形成延时(具体时常根据系统需求计算)。
  • 监测点应直接连接到被监控电源轨,避免受其它电路干扰;为保证稳定监测,上电时电源上升沿应平滑,若存在快速瞬态建议增加去耦电容。
  • 布局时将器件靠近被监控电源输入放置,缩短感测与复位输出走线,减小寄生电阻与干扰。
  • 在对可靠性要求高的应用中,应参考厂商数据手册中有关阈值容差、温漂与重置时序的详细规范以完成最终验证。

五、封装与采购

ME2808A30M3G 提供 SOT-23 表面贴装封装,适合自动贴片生产流程。具体封装尺寸、管脚排列和标记信息请参阅制造商规格书与最新目录;批量采购时可联系 MICRONE(南京微盟)或其授权分销渠道获取样品与技术支持。

备注:本文为器件概览与设计注意要点总结,电路最终实现建议以芯片完整数据手册为准,必要时进行实际板级测试验证。

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