WMSIC Electronic Components

MICRONE ME2108C50M5G

ModelME2108C50M5G
PackageSOT-23-5
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2108C50M5G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2108C50M5G
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.043g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227604917
Operating Temperature
25℃~+85℃@(TA)
Operating Voltage
900mV~6.5V
Switching Frequency
180kHz
Electronic Component
Electronic Component
Output Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2108C50M5G 产品概述

一、产品简介

ME2108C50M5G(MICRONE,南京微盟)是一款升压型DC‑DC转换器,输入电压范围0.9V~6.5V,可输出稳定5.0V电压,最大输出电流400mA。器件采用升压拓扑、内置开关管、非同步整流结构,开关频率约180kHz,静态电流仅50µA,工作温度范围为‑25℃~+85℃。封装为常见的小型SOT‑23‑5,适合空间受限的便携及工业应用。

二、主要性能特点

  • 低输入启动电压:支持最低0.9V输入启动,能够在电池电压下降时继续升压供电。
  • 稳定5V输出:输出精度适合给传感器、微控制器或外围电路提供5V电源。
  • 低静态电流:典型Iq≈50µA,适合低功耗或待机时间要求高的应用。
  • 内置开关管:简化外部布局与器件数量,但由于非同步整流,需要外接整流二极管(建议肖特基)。
  • 中等开关频率(≈180kHz):频率与效率、体积之间取得平衡,便于使用常见电感与电容实现优化设计。

三、典型应用场景

适用于便携式设备和功耗敏感系统,如:

  • 单节电池供电需要升至5V的便携仪表、手持终端;
  • 物联网节点、无线传感器、低功耗传感模块;
  • 工业控制的小功率升压前端;
  • 需要在电池电压下降时维持稳定5V输出的备用与唤醒电路。

四、外部器件与选型建议

  • 整流二极管:由于为非同步整流结构,需外接肖特基二极管,选择反向耐压和平均整流电流均满足输出条件的型号,低正向压降可提升转换效率。
  • 电感:选择适当电流额定值和较低直流电阻(DCR)的功率电感,以避免过大损耗与压降。
  • 输入/输出电容:推荐低ESR陶瓷电容,输入电容靠近芯片VIN端,输出电容靠近输出端以降低纹波与环路不稳定风险。
  • 负载与保护:为提高可靠性,可在输出端加滤波与过流/短路保护电路。

五、PCB与热设计要点

  • 开关节点(SW)走线应尽量短、宽,减少寄生电感与辐射噪声;输入与输出电容距离芯片引脚尽量近。
  • 为降低EMI,注意布局输入回路和功率回路,采用短环路设计并在必要处增加地平面。
  • SOT‑23‑5封装散热有限,连续高负载(接近400mA)时应评估温升,必要时扩展铜箔面积以辅助散热。

六、封装与采购信息

该器件采用SOT‑23‑5小封装,适合自动贴片生产与体积受限场合。购买与样片获取请联系MICRONE(南京微盟)授权经销商或代理,订购时注意确认完整型号ME2108C50M5G及合规参数以满足设计需求。

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