WMSIC Electronic Components

MICRONE ME2108A50M3G

ModelME2108A50M3G
PackageSOT-23-3L
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2108A50M3G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2108A50M3G
Electronic Component
1
Package
SOT-23-3L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.053g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227656159
Operating Temperature
25℃~+85℃
Operating Voltage
900mV~6.5V
Switching Frequency
180kHz
Electronic Component
Electronic Component
Output Voltage
2V~7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2108A50M3G 产品概述

一、产品简介

ME2108A50M3G 是南京微盟(MICRONE)推出的一款升压型 DC-DC 转换芯片,采用 SOT-23-3L 小封装,集成开关管,面向低电压启动与便携式电源升压应用。器件支持极低输入电压 0.9V 起动,输入电压范围 0.9V ~ 6.5V,输出为固定电压系列,覆盖 2V ~ 7V,可提供最高 400mA 连续输出电流,开关频率典型值 180kHz,静态工作电流仅 50uA,适合电池供电与低功耗场景。

二、主要规格要点

  • 功能类型:升压型(Boost)
  • 输入电压:0.9V ~ 6.5V(低压起动)
  • 输出电压范围:固定输出,2V ~ 7V(不同型号对应不同固定电压)
  • 最大输出电流:400mA
  • 开关频率:约 180kHz
  • 静态电流(Iq):50uA(典型,轻载有利于延长电池寿命)
  • 同步整流:否(非同步拓扑,通常需外接肖特基二极管)
  • 开关管:内置(简化外部器件与PCB设计)
  • 封装:SOT-23-3L
  • 工作温度范围:-25℃ ~ +85℃

三、核心优势

  • 低压起动能力:0.9V 起动支持单节碱性或镍氢电池、弱电池条件下仍能将电压提升到系统所需电平。
  • 低静态电流:50uA 的待机电流有利于延长电池待机寿命,适合周期性唤醒的物联网终端和便携设备。
  • 封装小巧:SOT-23-3L 封装便于小尺寸产品设计,降低 BOM 成本与占板面积。
  • 集成开关管:减少外部功率器件数量,简化设计与装配。

四、应用场景

  • 便携式电子:手持设备、电子烟、便携照明、迷你音响等需要从单节电池或低电压源升压的产品。
  • 物联网与传感终端:电池供电的无线传感器、资产跟踪器、遥测模块等。
  • 可穿戴设备与低功耗设备:注重待机寿命与体积的消费电子产品。
  • 通用升压电源:需要固定升压轨的各种嵌入式系统。

五、设计与使用建议

  • 采用非同步整流拓扑时,通常需外接低压降肖特基二极管作为整流元件,并选择合适电感与输入/输出电容以保证稳定性与效率。
  • 布局注意:输入电容、开关节点与二极管应尽量靠近芯片布局,减少走线环路面积以降低 EMI 与损耗。
  • 散热与负载:尽管集成开关管,长时间满载(接近 400mA)时需关注器件温升与封装热阻,必要时在 PCB 增加散热铜箔。
  • 启动与保护:若系统存在瞬态大电流需求,请评估输入电源能力并考虑添加软启动与限流措施以保障可靠启动。

六、封装与选型

ME2108A50M3G 提供 SOT-23-3L 小封装版本,适合空间受限的应用。选型时请根据目标输出电压选择相应固定输出型号,并参考芯片数据手册获取典型电路、外部元件选型与详细电气特性。

如需进一步的电路设计建议、典型应用电路或数据手册,请告知目标输出电压与具体应用场景,我可以提供更详细的布局与元件选型参考。

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