WMSIC Electronic Components

MICRONE ME6216A28M3G

ModelME6216A28M3G
PackageSOT-23-3
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME6216A28M3G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
120mV@(100mA);230mV@(200mA)
Electronic Component
MICRONE
Electronic Component
ME6216A28M3G
Electronic Component
1
Package
SOT-23-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0226539377
Operating Temperature
25℃~+125℃@(Ta)
Operating Voltage
9V
Output
Electronic Component
Output Voltage
2.8V
Output Current
300mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME6216A28M3G 产品概述

ME6216A28M3G 是 MICRONE(南京微盟)推出的一款高性能固定输出线性稳压器(LDO),输出电压为 2.8V,适合对噪声、纹波抑制和低静态电流有较高要求的便携与嵌入式系统。器件采用 SOT-23-3 小封装,单通道输出,最大输出电流可达 300mA,同时集成短路保护与过流保护,适合空间受限且需可靠保护的电源设计场合。

一、主要特点

  • 输出类型:固定输出,Vout = 2.8V
  • 输出电流:最高 300mA
  • 静态电流(Iq):典型 5 μA,适合低功耗应用
  • 工作温度范围:-25℃ ~ +125℃(Ta)
  • 封装:SOT-23-3,三引脚小封装
  • 品牌:MICRONE(南京微盟)

二、性能亮点

  • 低压差性能:压差仅 120mV(Iout = 100mA),200mA 时约 230mV,适合电池供电或低压差工作要求的场合,能在更低的输入与输出差压下维持稳压。
  • 优秀的电源纹波抑制:PSRR 约 65dB(1kHz),可有效抑制来自电源或外部开关噪声对敏感电路的干扰。
  • 超低静态电流:典型 5μA,在待机或低功耗模式下可以显著延长电池寿命。

三、保护与可靠性

  • 内置短路保护与过流保护:在异常负载或短路情况下自动限制输出电流,提升系统安全性与可靠性,便于工业与消费类产品使用。
  • 宽温度工作范围:可在-25℃至+125℃环境温度下稳定工作,满足多数工业级或严苛环境的需求。

四、引脚与封装说明

  • 封装形式:SOT-23-3(小型三引脚封装),适合表面贴装自动化生产。
  • 常见引脚功能:VIN(输入)、GND(接地)、VOUT(输出)。
  • 由于封装面积有限,散热能力依赖 PCB 布局与铜箔面积,建议在高功率或持续大电流工作时注意散热设计。

五、典型应用场景

  • 电池供电设备:便携式终端、可穿戴设备、IoT 节点与传感器模块
  • 嵌入式系统供电:MCU、外设与模拟前端的稳压供给
  • 通信与消费电子:对纹波抑制有要求的射频前端、音频放大器供电
  • 工业控制与测量:要求可靠保护与宽温工作的场合

六、使用建议与注意事项

  • 输入电压:在设计时应保证输入电压高于输出电压加上压差余量;在常见工作点(如 Vin ≈ 9V)器件能够稳定提供 2.8V 输出,但实际输入范围请参照器件详细数据表确认。
  • 输出电容:为保证稳压器稳定与良好瞬态响应,建议在输出端放置低 ESR 陶瓷或钽电容并靠近 VOUT 引脚。常见做法为 1μF~10μF 的陶瓷电容(具体容量与 ESR 以应用与数据手册建议为准)。
  • 布局与散热:尽量增大 VIN、VOUT 与 GND 的铜箔面积,缩短输入输出走线,输出端旁路电容靠近器件布局以降低噪声与提升 PSRR 表现。

七、典型电路与布局要点

  • 标准应用:VIN 旁接 0.1μF 陶瓷去耦电容,VOUT 侧并联主滤波电容(如 1μF~10μF),GND 良好接地。避免长导线和环路,减少寄生感抗及噪声耦合。
  • 散热建议:在 PCB 上为 SOT-23-3 的 GND 引脚和附近铜箔做热扩散处理,必要时在器件下方或周围增加过孔连接多层地平面以提高散热能力。

八、选型与采购建议

ME6216A28M3G 以其低静态电流、优秀 PSRR 和小封装优势,适合对功耗与电源质量敏感的便携与嵌入式应用。选型时请结合系统输入电压、最大工作电流、温度环境与散热条件,参考 MICRONE 的完整数据手册以获取典型参数曲线和详细约束(如输入电压范围、输出容抗兼容性及过流保护特性等)。购买时确认封装(SOT-23-3)与生产批次,以确保一致性与可追溯性。

如需更详细的电气特性表、典型性能曲线或参考设计,请告知,我可进一步整理并给出针对性的电路建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.