WMSIC Electronic Components

MICRONE ME8200M6G-N ME8200M6G

ModelME8200M6G-N
PackageSOT-23-6
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME8200M6G-N
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME8200M6G-N
Electronic Component
1
Package
SOT-23-6
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.04g
Electronic Component
1
Features
EMI Optimization;; Audio;; (UVP); (OVP); (OCP)
Electronic Component
Electronic Component
Electronic Component
BM0228592368
Electronic Component
PWM
Operating Temperature
20℃~+85℃
Operating Voltage
10V~30V
Switching Frequency
60kHz~70kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME8200M6G-N 产品概述

ME8200M6G-N 是南京微盟(MICRONE)推出的一款用于隔离型 AC-DC 开关电源的控制器,封装为 SOT-23-6。器件工作电压范围宽(10V~30V),开关频率在 60kHz~70kHz 之间,最大占空比可达 80%,并集成了欠压保护(UVP)、过压保护(OVP)和过流保护(OCP),适合中小功率离线隔离电源设计。

一、核心特性

  • 工作电压:10V ~ 30V,适应多种供电与辅助绕组供电场景。
  • 开关频率:60kHz ~ 70kHz,可在中频段取得良好效率与磁性元件体积之间的折中。
  • 最大占空比:80%,对变压器匝比与最大输出功率有直接影响,利于提升在低输入电压下的输出能力。
  • 保护功能:集成欠压保护、过压保护与过流保护,提升系统可靠性并简化外围电路设计。
  • 隔离型设计:适配隔离型拓扑(如离线反激式/正激式),满足安全与EMC要求。
  • 封装:SOT-23-6,适合空间受限的消费类和工业终端产品。

二、典型功能与用途

ME8200M6G-N 适用于离线隔离式开关电源的控制回路,常见应用包括适配器、消费类充电器、工控电源、机顶盒与电视机背光供电等。器件适合用作反激或类似拓扑的 PWM 控制核心,借助外部功率 MOSFET 与变压器实现隔离输出。

三、设计要点与建议

  • 占空比与变压器设计:最大占空比 80% 为设计留有余量,但在选择初级匝比与磁芯时须确保在最低输入电压下不会进入磁饱和,并满足最大占空比下的瞬态要求。
  • 电流检测与 OCP:建议采用低阻值电流取样电阻配合芯片的电流检测引脚,以准确限流并避免器件误动作;取样电阻功率需按最大峰值电流选型。
  • 吸收与钳位:在主开关管收尾需配置 RCD 或有源钳位,限制过压尖峰,保护器件与缔造稳定的应力环境。
  • VCC 供电与启动:合理选择启动电阻、辅助绕组与旁路电容,确保 VCC 在稳态与启动过程中的可靠性与抗干扰性,同时在 VCC 上做好去耦与滤波。
  • EMI 与布局:60–70kHz 属中频段,布局应缩短高电流环路,靠近器件布置去耦电容与取样电阻,适当安排共模滤波器与磁屏蔽以满足 EMI 要求。
  • 热管理:SOT-23-6 封装热阻相对较大,需注意环境温度(-20℃~+85℃)下的散热与功耗控制,必要时采用散热片或改善周围散热路径。

四、封装与引脚提示

SOT-23-6 小封装有利于缩小 PCB 面积,但引脚数有限,典型引脚功能包括 VCC、GND、功率驱动/开关引脚、过流检测、反馈/补偿与振荡/频率设定等。具体引脚定义、典型应用电路与保护阈值请以官方数据手册为准。

五、应用建议与资料获取

在进行产品开发时,建议参考官方参考设计、典型电路与布板指南,选用与系统目标相匹配的功率 MOSFET、磁性元件与滤波元件。采购与技术资料可向 MICRONE(南京微盟)或其授权分销渠道索取完整数据手册与参考设计,以确保设计参数与保护阈值满足系统需求。

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