WMSIC Electronic Components

MICRONE ME8202SG

ModelME8202SG
PackageSOP-8
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME8202SG
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME8202SG
Electronic Component
1
Package
SOP-8
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.174g
Electronic Component
1
Features
(UVP); (OTP); (OVP); (OLP); (OCP)
Electronic Component
Electronic Component
Electronic Component
BM0227715811
Electronic Component
PWM
Operating Temperature
20℃~+85℃
Operating Voltage
12V~23V
Switching Frequency
60kHz~70kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME8202SG — 隔离型反激式 AC-DC 控制器产品概述

一、产品简介

ME8202SG 是 MICRONE(南京微盟)推出的一款隔离型反激式 PWM AC-DC 控制器,采用 SOP-8 封装,适用于中低功率开关电源和适配器。器件工作电压范围为 12V ~ 23V,开关频率典型值 60kHz ~ 70kHz,最大占空比 85%,工作模式为 PWM 调制,采用副边反馈实现精确稳压,集成多种保护功能以提高系统可靠性。

二、主要特性

  • 拓扑结构:反激式(隔离型);适配离线开关电源常见应用。
  • 开关参数:工作频率 60kHz ~ 70kHz,最大占空比可达 85%,便于在轻载与重载间取得平衡。
  • 保护功能:欠压保护(UVP)、过温保护(OTP)、过压保护(OVP)、过载保护(OLP)、过流保护(OCP)。
  • 反馈与控制:采用副边反馈(通常配合光耦与参考基准如 TL431),稳定性与精度可控。
  • 环境与可靠性:工作温度范围 -20℃ ~ +85℃,适合工业与民用环境。
  • 封装:标准 SOP-8,便于常规模块化生产。

三、典型应用场景

  • 手机、平板、便携设备与小型家用电源适配器(隔离输出)。
  • 电视机、机顶盒、网络设备的主/待机电源。
  • 工业控制与传感器模块的隔离供电。
  • 通用离线开关电源和充电器解决方案。

四、设计要点与建议

  • 辅助电源设计:器件工作电压范围 12~23V,常用方式为辅助绕组供电或启动电阻+VCC 电容配合稳压。须设计好 VCC 充放电与欠压上电条件,避免误触发。
  • 反馈回路:采用副边参考(如 TL431)与光耦回传,注意补偿网络的相位裕度与输出电容 ESR 对环路稳定性的影响。
  • 开关器件与变压器:依据 60~70kHz 频率选择磁芯与绕组,控制峰值电流在 OCP 设定范围内,设计留有占空比上限(85%)的余量。
  • 浪涌与过压抑制:输入端应有足够的滤波与浪涌吸收(NTC、MOV、TVS),输出侧配合 OVP 保护电路。
  • 布局与 EMI:尽量缩小高 di/dt 回路面积,严格区分初级与次级地,输入滤波、电感与变压器靠近,光耦与次级补偿元件布局紧凑有利于抑制 EMI。

五、保护机制与可靠性

ME8202SG 集成 UVP/OTP/OVP/OLP/OCP 等多重保护,可在异常工况(如短路、过载、过温或开路)时快速响应,降低系统损伤风险。建议在 PCB 上为温度敏感元件留出散热路径,并在变压器及功率器件周围做充分热仿真与测试。

六、选型与注意事项

  • 若需适配更高功率或更高效率方案,应关注变压器设计、开关损耗与散热方案。
  • 采用副边反馈时,注意光耦线性区与 TL431 的最小电流要求,避免在轻载下反馈丢失导致输出飘移。
  • 生产测试阶段应覆盖各种保护触发点(过流、过压、欠压、过温)以验证系统行为。

ME8202SG 适用于对隔离、安全性和多重保护有要求的中低功率开关电源方案,是实现可靠、经济型反激式电源设计的常用控制芯片选择。若需具体引脚功能、电气特性曲线或典型应用原理图,可提供更详细的参考资料与设计模板。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.