WMSIC Electronic Components

MICRONE ME2109FM5G

ModelME2109FM5G
PackageSOT-23-5
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2109FM5G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2109FM5G
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.042g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226539343
Operating Temperature
25℃~+85℃
Operating Voltage
1.8V~6V
Switching Frequency
255kHz~345kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2109FM5G 产品概述

一、产品简介

ME2109FM5G 是 MICRONE(南京微盟)推出的一款升压型 DC-DC 转换芯片,封装为 SOT-23-5,适用于电池供电和便携式设备的升压场合。芯片采用外置开关管拓扑,输出可调,输入电压范围宽(1.8V–6V),工作温度范围为 -25℃ 至 +85℃,静态电流仅 100µA,适合低功耗系统长待机应用。

二、主要性能参数

  • 工作电压(VIN):1.8V ~ 6V
  • 输出电压(VOUT,可调):1.5V ~ 6.5V
  • 拓扑结构:升压(Boost),外置开关管(外置 MOSFET)
  • 开关频率:255kHz ~ 345kHz(典型值范围)
  • 静态电流(Iq):约 100µA
  • 输出通道数:1 通道
  • 封装:SOT-23-5
  • 工作温度:-25℃ ~ +85℃

三、功能与特点

  • 低输入电压启动与工作:支持 1.8V 起始输入,适合单节锂电或两节碱性/镍氢电池供电。
  • 可调输出:通过外部分压回路设定目标输出电压,覆盖 1.5V–6.5V 范围。
  • 低静态电流:静态电流约 100µA,有利于延长电池使用寿命。
  • 中等开关频率:255kHz–345kHz 在效率与外部元件体积之间取得平衡,方便选择电感与滤波电容。
  • 外置开关管设计:支持选型优化(低 Rds(on)、低驱动损耗 MOSFET),适应不同负载与功率需求。

四、典型应用场景

  • 手持仪器、便携式仪表与传感器节点
  • 可穿戴设备与低功耗蓝牙模块(需升压供电时)
  • LED 驱动(小功率恒流或恒压场合)
  • 电池管理与备用电源提升电压场景

五、外部器件与设计建议

  • 开关 MOSFET:选用 N-channel MOSFET,Vdss 建议 ≥ 1.5–2 倍 VOUT,低 Rds(on) 以降低导通损耗,尽量选择门电荷(Qg)小的器件以减少驱动损耗。
  • 二极管:若为非同步方案,选用低 Vf 的肖特基二极管,反向耐压应 ≥ VOUT + 安全裕量,平均电流能力大于负载电流。
  • 电感:根据输出电流与开关频率选择,建议饱和电流大于最大负载电流,典型电感量视设计计算(可在几十 µH 到几 µH 范围内取值),需注意铜损与磁饱和。
  • 电容:输入端 10µF 以上 MLC 陶瓷,输出端使用低 ESR 大容量陶瓷(如 22µF~47µF)以减小纹波并保证瞬态响应。
  • 回路设定:通过反馈电阻分压器精确设定输出电压,注意反馈节点与地的连接可靠、布线短且稳定。

六、PCB 布局与热管理

  • 将电感、肖特基(或同步二极管)、开关 MOSFET 与芯片的开关回路紧密布置,缩短高电流回路长度以降低 EMI 与损耗。
  • 输入和输出去耦电容靠近芯片 VIN 与 VOUT 引脚放置。
  • SOT-23-5 封装热量有限,如长期高功率工作需考虑散热策略(增加铜箔面积、使用多层板过孔散热)。
  • 注意走线宽度与过孔,以满足电流承载需求并降低寄生电阻/电感。

七、调试与选型注意事项

  • 启动与稳态:在低电压输入(接近 1.8V)时验证启动可靠性及输出稳定性,调整软启动或补偿网络以避免振荡。
  • 稳态效率:效率受 MOSFET Rds(on)、开关损耗、二极管 Vf、磁性元件损耗影响;并在实际工况下测量确认。
  • EMC 与滤波:若对 EMI 敏感,可在输入侧增加 RC 或 LC 滤波,并注意接地与屏蔽。
  • 可靠性验证:进行温升、短路保护与输出过压/过流测试,确保在 -25℃~+85℃ 范围内性能稳定。

总结:ME2109FM5G 以其宽输入、可调输出与低静态电流特性,适合多种便携与低功耗升压场合。合理选配外部 MOSFET、二极管、电感与电容,并按建议的 PCB 布局与热管理方法执行,可获得稳定、可靠的升压解决方案。

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