WMSIC Electronic Components

MICRONE ME78M05K3G

ModelME78M05K3G
PackageTO-252-2(DPAK)
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME78M05K3G
Type
MICRONE
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME78M05K3G
Electronic Component
1
Package
TO-252-2(DPAK)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.3g
Electronic Component
1
Electronic Component
BM0227600526
Operating Temperature
25℃~+125℃@(Tj)
Operating Voltage
35V
Output
Electronic Component
Output Voltage
5V
Output Current
500mA
Output Type
Electronic Component
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME78M05K3G 产品概述

一、产品简介

ME78M05K3G 是南京微盟(MICRONE)推出的一款高输入压差线性低压差稳压器(LDO),为固定输出型,输入耐压高达35V,输出稳压为5.0V,最大输出电流500mA。器件定位于对噪声抑制和稳定性有较高要求的电源前端与本地给电场合,采用TO-252-2(DPAK)封装,便于表面贴装和散热设计。

二、主要特性

  • 固定输出:5.0V,输出极性为正极
  • 最大输出电流:500mA(单通道)
  • 最大工作电压:35V(输入端)
  • 电源纹波抑制比(PSRR):80dB @ 120Hz(优秀的工频纹波与整流残余抑制能力)
  • 保护功能:短路保护、过流保护、过热保护
  • 工作结温范围:-25℃ ~ +125℃(Tj)
  • 封装:TO-252-2 (DPAK)

三、电气与性能要点

ME78M05K3G 在中高直流母线(例如汽车、工业24V/12V经过升压或直供)到5V负载供电的场景表现稳健。80dB@120Hz 的PSRR表明器件在滤除整流后低频纹波方面非常有效,有利于模拟电路、AD/DA 和通信模块的本地稳压供电。

四、热管理与保护机制

器件集成过流与过热保护,能在异常工况下自动限制或关闭输出以防损坏。TO-252-2 封装具有良好的散热通道,通过合理的PCB热铜箔和过孔布局可以显著降低结温,提高持续500mA输出能力与可靠性。

五、封装与安装建议

TO-252-2 (DPAK) 适合表面贴装生产,底部与散热脚需与大面积铜箔相连以增强散热。布板时建议将输入电容靠近VIN脚放置,输出电容靠近VOUT和地脚,尽量缩短回流路径并使用固体低阻抗接地层。

六、典型应用与设计建议

适用于工业控制电源、嵌入式系统的5V本地供电、通信设备接口电源、传感器与ADC参考电源等。为保证稳定性和瞬态响应,建议在输入侧加入适当旁路电容(如0.1–1µF)并在输出端使用低ESR陶瓷电容(建议4.7–10µF,视系统回落与负载瞬态而定),同时为热管理预留充足铜箔面积和过孔。

七、可靠性与选型建议

在选择 ME78M05K3G 时,应结合实际工作环境(最高结温、环境散热条件、长期负载比例)评估散热设计余量。对于要求连续高电流或高温工况的应用,建议做热仿真并验证PCB散热措施,确保器件工作在安全区域内以延长使用寿命。

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