WMSIC Electronic Components

MICRONE ME2188A50M3G

ModelME2188A50M3G
PackageSOT-23
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2188A50M3G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2188A50M3G
Electronic Component
1
Package
SOT-23
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.038g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0225828416
Operating Temperature
40℃~+125℃
Operating Voltage
900mV~5V
Switching Frequency
320kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2188A50M3G 产品概述

一、概述

ME2188A50M3G 是 MICRONE(南京微盟)推出的一款高集成度升压型 DC-DC 转换器,采用升压拓扑并集成开关管与同步整流,面向电池供电与低功耗便携设备的 5V 升压输出场景。芯片工作温度范围宽(-40℃ ~ +125℃),适合工业级与消费类产品使用。

二、主要参数

  • 拓扑结构:升压(Boost)
  • 同步整流:是(集成同步 MOSFET,提高效率)
  • 开关管:内置
  • 静态电流(Iq):7 μA(极低待机功耗)
  • 输出电流:最大 300 mA
  • 输入电压范围:0.9 V ~ 5.0 V
  • 输出电压:5.0 V(固定)
  • 开关频率:320 kHz
  • 输出通道数:1 路
  • 功能类型:升压型 DC-DC
  • 封装:SOT-23
  • 品牌:MICRONE(南京微盟)

三、产品特点与优势

  • 极低静态电流(7 μA),非常适合需长期待机的电池供电系统与 IoT 节点。
  • 同步整流设计有效降低整流损耗,在中小负载下仍可取得较高效率,适合 5V 外设供电。
  • 宽输入电压覆盖 0.9V 起动,能够从低压能量源(如单节干电池或能量采集后端)启动并升压至 5V。
  • 封装小巧(SOT-23),便于空间受限的便携产品与模块化设计。

四、典型应用场景

  • 电池驱动的便携设备(1 节或多节电池,需升压至 5V 为 MCU、传感器或外设供电)
  • 可穿戴设备、低功耗无线传感器网络节点(LoRa、BLE、NB-IoT 外设供电)
  • 小功率 USB 供电模块、升压电源模块与能量采集系统

五、外部元件与 PCB 布局建议

  • 输入/输出电容:推荐使用低 ESR MLCC(例如 4.7 μF ~ 22 μF),靠近芯片 VIN、VOUT 引脚布局,减小寄生。
  • 电感:选择低 DCR、能承受峰值电流的焙烧功率电感,常见经验范围 4.7 μH 至 22 μH(需依据输入电压与输出电流进一步优化)。
  • 二极管:采用同步整流结构,无需外部整流二极管,但注意 MOSFET 驱动与回路稳定性。
  • 布局要点:缩短开关节点(SW)到电感与输出电容的回路,保证大地平面连续,敏感模拟与信号线远离开关节点,芯片散热面尽量与铜皮相连以利热量扩散。

六、可靠性与选型注意

  • 在接近最大输出电流(300 mA)与高温工作条件下,应注意热设计与散热降额,保证长期可靠性。
  • 具体保护功能(过流、短路、热关断等)与详细电气特性请参阅官方数据手册,设计时按数据手册推荐的典型应用电路与外部器件选择以保证稳定性与效率。

如需参考电路图、器件引脚定义或效率曲线与典型特性图,请告知,我可基于数据手册为你整理参考设计与选件建议。

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