WMSIC Electronic Components

MICRONE ME2169AM6G

ModelME2169AM6G
PackageSOT-23-6
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2169AM6G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2169AM6G
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.042g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0264518673
Operating Temperature
40℃~+150℃
Operating Voltage
2.5V~6V
Switching Frequency
800kHz~1.2MHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2169AM6G 升压型DC-DC电源芯片产品概述

ME2169AM6G是南京微盟(MICRONE)针对低电压输入、大电流升压场景优化设计的外置开关管DC-DC电源芯片,具备宽工作电压范围、低静态功耗、工业级宽温等核心特性,可灵活适配电池供电、车载、工业控制等多种应用需求。

一、核心拓扑与功能定位

ME2169AM6G采用升压式(Boost)异步整流拓扑:通过电感储能-释能原理实现电压提升,异步整流设计(无内置同步整流管)依赖外部二极管续流,配合外置N沟道MOS管作为开关管,可根据输出功率需求灵活匹配MOS管,兼顾效率与设计灵活性。

产品为单通道可调输出,通过外部反馈电阻网络可设置目标输出电压,覆盖从几伏到十几伏的常见升压需求,适用于需定制输出电压的场景。

二、关键电气参数详解

ME2169AM6G的核心参数针对性解决低电压升压的痛点,具体如下:

  • 输入电压范围:2.5V~6V,覆盖单节锂电池(3.7V/4.2V)、2节AA电池(3V)及低电压稳压电源等常见输入源;
  • 输出电流能力:支持3A最大输出(需匹配低导通电阻MOS管及电感),满足中小功率升压需求;
  • 开关频率:800kHz~1.2MHz,处于中高频段,可显著减小电感、电容等外围元件体积,适合便携设备的小型化设计;
  • 工作温度范围:-40℃~+150℃,符合工业级宽温标准,可稳定工作于车载、户外及极端环境;
  • 静态电流(Iq):典型值60uA,低待机功耗有效延长电池供电设备的续航时间;
  • 开关管配置:外置N沟道MOS管(需外接),用户可根据输出电压、电流需求选择合适型号(如低Rds(on)的30V级MOS管),提升设计灵活性。

三、封装与引脚功能

ME2169AM6G采用SOT-23-6小型贴片封装,尺寸紧凑(约2.9×1.6×1.1mm),节省PCB空间,适合便携设备集成。引脚功能明确:

  1. VIN:电源输入脚,需外接输入电容滤波;
  2. EN:使能控制脚,高电平有效(可通过MCU或开关控制芯片启停);
  3. FB:反馈电压输入脚,外接分压电阻网络设置输出电压;
  4. SW:开关节点脚,外接外置MOS管漏极、电感一端及续流二极管阳极;
  5. GND:接地脚,需可靠连接至PCB地平面;
  6. COMP:环路补偿脚,外接RC网络稳定输出环路,避免振荡。

四、典型应用场景

结合参数特性,ME2169AM6G适用于以下场景:

  • 便携电子设备:移动电源升压(5V/9V输出)、手持测试仪、蓝牙音箱等电池供电设备;
  • 工业控制模块:低电压传感器供电升压、PLC输入输出模块电源;
  • 车载电子系统:12V车载电源降压后(5V输入)升压至12V或其他电压,宽温适应车载环境;
  • 低功耗设备:智能穿戴、物联网终端等需低待机功耗的电池供电产品。

五、设计要点与优势总结

设计注意事项

  1. MOS管选型:需选择低导通电阻(Rds(on)≤10mΩ)、电压等级≥20V的N沟道MOS管,避免导通损耗过大;
  2. 电感选型:推荐1022uH低DCR(直流电阻)电感,匹配800kHz1.2MHz开关频率,提升效率;
  3. 反馈电阻:采用1%精度电阻,确保输出电压精度;
  4. 补偿网络:COMP脚外接10kΩ电阻+100nF电容(典型值),稳定环路响应。

产品核心优势

  • 宽输入适配:覆盖常见电池及低电压电源,无需额外升压前级;
  • 低待机功耗:60uA静态电流,延长电池续航;
  • 工业级可靠性:-40~150℃宽温,适应恶劣环境;
  • 设计灵活性:外置MOS管可匹配不同功率需求,降低系统成本。

ME2169AM6G凭借高性价比与灵活的设计特性,成为低电压升压应用的优选方案,可满足从便携到工业场景的多样化需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.