Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICRONE ME6211A30M3G-N ME6211A30M3G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICRONE ME6211A30M3G-N
- Type
- MICRONE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 100mV@(100mA)
- Electronic Component
- MICRONE
- Electronic Component
- 50uVrms
- Electronic Component
- ME6211A30M3G-N
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Electronic Component
- BM0227605552
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 6V
- Output
- Electronic Component
- Output Voltage
- 3V
- Output Current
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ME6211A30M3G-N 产品概述
一、产品简介
ME6211A30M3G-N 是南京微盟（MICRONE）推出的一款固定输出线性低压差稳压器（LDO），输出电压为 3.0V，输入工作电压 6V，单通道正极输出设计。器件在小型 SOT-23 封装中集成了使能功能及多重保护机制，适合对噪声、纹波抑制和快速保护有较高要求的便携与工业类电子系统。
二、主要特性
- 固定输出：3.0V 正向输出
- 最大输出电流：500mA
- 工作电压：6V（器件额定输入）
- 静态电流（Iq）：30μA（待机/静态功耗低）
- 使能（EN）功能：便于电源管理与系统省电
- 过流保护与短路保护：提高系统可靠性与故障自恢复能力
- 工作温度范围：-40℃ ~ +150℃，适应高温环境
- 噪声：50μVrms（典型）
- 电源抑制比（PSRR）：70dB @ 1kHz
- 压差：100mV @ 100mA（低压差在轻载条件下可减少功耗）
- 封装：SOT-23，适合空间受限设计
三、电气与热设计要点
- 压差说明：在 100mA 负载时典型压差仅 100mV，说明在中小电流工况下转换效率高。需注意在 500mA 输出时压差与功耗会随差分电压上升而增加。
- 热耗计算：器件功耗约为 (Vin − Vout) × Iout。举例 Vin=6V、Vout=3V、Iout=500mA 时，PD ≈ 1.5W，SOT-23 封装在此功耗下需谨慎评估散热与环境温升，必要时采用降额设计或增加散热路径。
- 输出与输入电容：为确保稳定与瞬态响应，建议靠近器件引脚配置低 ESR 的输入/输出电容（如陶瓷电容），并遵循 PCB 布局最小化回流环路。
四、保护与可靠性
ME6211A30M3G-N 内置过流与短路保护，可在异常负载或输出短路时限制电流并保护器件与负载。宽温工作范围（-40℃~+150℃）和低静态电流特性，使其在工业级或高温场景下具有较好可靠性。
五、典型应用
- 便携式设备、电池供电终端（智能传感器、手持终端）
- 工业控制与数据采集模块（受高温与噪声抑制要求）
- 通信与物联网节点（对低噪声与高 PSRR 有需求）
- 电源后级稳压、数字电路或模拟前端供电
六、选型与使用建议
- 在高负载（接近 500mA ）下关注器件结温与 PCB 热阻，必要时降低输入电压差或限制最大工作电流以避免过热。
- 输出电容选择需参照器件资料以保证稳定性；一般推荐陶瓷电容放置在输出端近旁以改善瞬态响应与减小噪声。
- 设计中利用使能引脚实现电源序列与低功耗控制；确保使能电平满足器件要求。
- 在实际设计前，建议查阅完整版数据手册以确认所有限制参数、典型曲线及推荐外部元件值。
ME6211A30M3G-N 以其低静态电流、良好的噪声与纹波抑制以及完备的保护功能，适合在对尺寸和电源质量有较高要求的系统中作为稳压解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
