WMSIC Electronic Components

MICRONE ME2807A30M3G

ModelME2807A30M3G
PackageSOT-23
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2807A30M3G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2807A30M3G
Electronic Component
1
Package
SOT-23
Electronic Component
Supervisorand positions IC
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0264777465
Operating Temperature
40℃~+85℃
Operating Voltage
1.5V~18V
ICType
Voltage Detector
Output Type
Electronic Component
Voltage
3V
Static Current(Iq)
1.8uA
Supervisor Voltage
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2807A30M3G 产品概述

一、产品简介

ME2807A30M3G 是南京微盟(MICRONE)推出的一款单路电压检测器/复位监控芯片,采用 SOT-23 小型三引脚封装。该器件用于检测系统电源电压并在电压低于设定阈值时提供复位或监控信号,保护单片机和数字电路在上电、掉电或电压波动期间免受异常工作影响。器件设计偏向超低功耗,适合电池供电和便携式设备。

二、主要参数与特性

  • 检测阈值(名义值):3.0 V(ME2807A30M3G)
  • 工作电压范围:1.5 V ~ 18 V
  • 静态电流(Iq):典型 1.8 μA,适合低功耗应用
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 监测路数:1 路电压检测
  • 看门狗:无
  • 手动复位功能:无
  • 封装:SOT-23(3 引脚)
  • 芯片类型:电压检测器(Voltage Detector / Reset IC)

三、典型功能行为

ME2807A30M3G 在电源电压下降至低于阈值(3.0 V)时输出复位/报警信号,直至电压回升并稳定超过阈值后才释放复位状态。具体输出行为(例如输出极性、是否为开漏、复位保持时间或迟滞值)请以器件数据手册为准;常见用法是将器件的输出连接到 MCU 的复位脚或其他关键数字电路的使能/复位输入,以实现上电复位(POR)和低电压锁定(brown‑out protection)。

四、封装与引脚

  • 封装类型:SOT-23(3 引脚),便于表面贴装和空间受限的 PCB 布局。
  • 常见引脚分配(典型):VCC / GND / RESET(实际引脚定义请参照官方规格书)。由于输出类型(开漏或推挽)和极性可能会有所不同,设计时务必查看数据手册确认并在需要时添加上拉电阻或隔离元件。

五、典型应用场景

  • 单片机(MCU)与数字系统的上电复位与欠压保护
  • 电池供电设备:手持终端、遥控器、传感器节点(IoT)、可穿戴设备
  • 工业控制与仪表:防止瞬态掉电导致的数据损坏或误动作
  • 多电源系统的电源监控与简单电源序列管理(单路检测)

六、应用建议与设计注意事项

  • 布局:将检测器靠近被监控器件的电源引脚放置,以减少线路压降和噪声影响。
  • 去耦:在 VCC 和 GND 之间放置 0.1 μF 陶瓷电容以抑制电源瞬变;具体值参考系统 EMI/稳压要求。
  • 输出接口:确认输出类型(开漏/推挽)与 MCU 复位脚的兼容性。若为开漏输出,需在系统中提供合适的上拉电阻。
  • 额外功能:器件本身不含看门狗和手动复位按键功能,如系统需要,可并用独立看门狗芯片或在板上增加手动复位电路(例如按键 + RC 或使用具有手动复位功能的复位管理器)。
  • 工作电压裕量:虽然器件支持 1.5 V 至 18 V 的输入范围,但检测阈值及电路行为在极端电压边界可能受影响,设计时应留有裕量并验证实际系统条件下的表现。
  • 环境与可靠性:工作温度范围为 -40 ℃ ~ +85 ℃,适用于大多数工业与消费类应用;高温或强干扰环境下建议做额外测试验证。

七、优缺点与选型参考

优点:

  • 超低静态电流(1.8 μA),非常适合电池供电与低功耗设计
  • 宽工作电压范围,适配多种电源方案
  • 小体积 SOT-23 封装,便于密集布局

限制:

  • 不包含看门狗功能与手动复位按键支持,功能上较为简洁
  • 详细输出特性(如极性、输出驱动能力、迟滞和复位延时)需参考数据手册确认

选型建议:

  • 如果只需简单的欠压检测与上电复位,且强调低功耗与小尺寸,ME2807A30M3G 是合适选择。
  • 若系统需要看门狗或外部手动复位,请同时考虑带看门狗或带手动复位功能的复位管理器,或在系统中补充相应电路。

如需进一步的电气参数曲线、引脚图或参考电路图,请参考 ME2807A30M3G 官方数据手册或联系供应商获取最新资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.