WMSIC Electronic Components

MICRONE ME6215C50M5G

ModelME6215C50M5G
PackageSOT-23-5
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME6215C50M5G
Type
MICRONE
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME6215C50M5G
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0095344011
Operating Temperature
40℃~+85℃
Operating Voltage
18V
Output
Electronic Component
Output Voltage
5V
Output Current
300mA
Output Type
Electronic Component
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME6215C50M5G 产品概述

一、产品简介

ME6215C50M5G 是南京微盟(MICRONE)推出的一款固定输出 5V 的低压差线性稳压器(LDO),采用 SOT-23-5 小封装,面向空间受限的电源降压与稳压场景。器件支持最大输出电流 300mA,内置过流保护,额定工作温度范围为 -40℃ 至 +85℃,工作电压可达 18V(输入端允许电压范围应参考详细数据手册)。该产品适合对噪声、纹波要求较高且输出电压稳定可靠的应用。

二、主要特性

  • 固定输出:5.0V 输出,极性为正极输出,方便数字电路与模拟电路直接供电;
  • 输出电流:最高可提供 300mA 连续输出能力,适合中小功率负载;
  • 保护功能:集成过流保护(OCP),在负载短路或过载情况下限制输出电流,提升系统可靠性;
  • 工作温度:-40℃ ~ +85℃,满足工业级温度环境应用需求;
  • 封装:SOT-23-5,利于表面贴装(SMT)工艺与紧凑电路板布局;
  • 低压差特性:设计为低压差线性稳压器,适合输入电压与输出电压差较小时仍保持稳压性能。

三、典型应用场景

  • 工业控制与嵌入式系统:为 MCU、传感器、接口芯片提供稳定 5V 电源;
  • 通信与仪表:对供电噪声敏感、需低纹波电源的模块;
  • 消费电子:小型电源模块、外设供电、接口电源管理;
  • 电源后级稳压:在开关电源降压后进行精密滤波稳压,提升系统 EMI 与噪声性能。

四、使用注意与设计建议

  • 热耗与散热计算:线性稳压器的功耗为 (Vin - Vout) × Iout。若输入为 18V,输出 5V,满载 300mA 时耗散功率约为 3.9W,此功率远超 SOT-23-5 的直接散热能力。建议在大压差或大电流工况下采用:降低输入电压、分摊负载、改用降压(Buck)模块或增加散热措施(如扩大 PCB 散热铜箔、使用热通孔等)。
  • 输入/输出电容:为保证稳定性与瞬态响应,需在输入端并联合适的去耦电容(常用 1µF10µF 陶瓷或钽电容,耐压选型需>=Vin最大);输出端一般建议使用低 ESR 的陶瓷或钽电容(典型 1µF10µF),具体容量与 ESR 要参考器件数据手册中的稳定性要求。
  • PCB 布局建议:输入电容与稳压器 VIN 引脚靠近放置,输出电容靠近 VOUT 引脚;GND 引脚应与地平面良好连接,尽量缩短高频回流路径;避免在热源附近布置器件,必要时通过过孔增加散热通道。
  • 保护与启动:若系统存在较大输入浪涌或瞬态,建议在输入端加装熔断保护或 TVS 抑制;如需片上使能(EN)功能,请参照手册控制使能脚,避免在 PCB 布局中将 EN 悬空。

五、封装与引脚(典型)

  • 封装形式:SOT-23-5,适合自动贴装与批量生产;
  • 常见引脚功能(以同类产品为参考):VIN(输入)、VOUT(输出)、GND(地)、EN/ENB(使能/关断,若器件支持)、BYP/NC(旁路或空脚,视型号而定)。正式设计时请以官方数据手册引脚定义为准。

六、选型与替代建议

  • 在高压差大电流场合,优先评估功耗与散热能力,必要时考虑开关降压芯片以提高效率;
  • 若需要不同输出电压或更大输出电流,可在 MICRONE 或其他厂商产品线中查找相应型号;同类封装的 LDO 在低噪声、快速瞬态响应方面有所不同,选型时兼顾 quiescent current(静态电流)、噪声、PSRR 等指标。

七、结论

ME6215C50M5G 以其固定 5V 输出、300mA 的输出能力、过流保护与工业温度等级,适合对稳定性与可靠性有较高要求的中低功率应用。设计时应重视热耗管理与外围电容稳定性,以确保在目标工作条件下长期稳定运行。详细电气参数与典型应用电路请参阅官方数据手册以获得准确设计依据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.