WMSIC Electronic Components

MOLEX 5601240101

Model5601240101
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 5601240101
Type
MOLEX
Unit
Electronic Component
Minimum package
15000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5601240101
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.06g
Electronic Component
1
Electronic Component
DuraClik(MX 2.0)
Electronic Component
BM0265579917
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
125V
Electronic Component
Electronic Component
Electronic Component
15000
Electronic Component
0.35
(OD)
1.4mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 5601240101 压接端子产品概述

一、产品归属与核心定位

MOLEX 5601240101是DuraClik MX 2.0系列下的一款压接端子,专为22AWG(0.35mm²)线规导线设计,属于小型化电气连接组件。该端子依托DuraClik系列的耐用性设计,聚焦紧凑空间内的可靠连接需求,可与同系列连接器壳体、触头组件配对使用,是电子设备内部信号/低功率电源传输的基础元件。

二、关键技术参数

该端子的核心参数明确适配目标应用场景,具体包括:

  • 线规适配:22AWG(对应横截面积0.35mm²),满足小型导线的压接需求;
  • 绝缘外径兼容:1.4mm,适配常规绝缘层厚度的导线(避免绝缘层过厚导致压接不牢);
  • 电气额定值:125V交流/直流,支持低到中等电压等级的电路连接;
  • 触头形式:压接式设计,适合自动化批量生产,压接后保持稳定的机械锁合与电气性能。

三、材质与镀层特性

端子核心触头采用铜合金材质,兼具良好的导电性能与机械强度,能有效降低接触电阻(减少电能损耗),同时具备一定的抗变形能力;触头表面镀层为锡,具有以下关键优势:

  1. 抗腐蚀性能:锡镀层可抵御环境中的湿气、盐雾等腐蚀因素,延长端子在复杂工况下的使用寿命;
  2. 焊接兼容性:与波峰焊、手工焊等常见焊接工艺兼容,便于后续组装或维修时的二次加工;
  3. 接触可靠性:锡镀层的表面特性可减少触头氧化,保持稳定的电气接触,降低信号中断或功率损耗风险。

四、典型应用场景

结合MX 2.0系列的小型化特点与5601240101的参数,该端子广泛应用于:

  • 小型工业控制设备:PLC模块、传感器节点(如温度/压力传感器)的内部连接;
  • 智能家居终端:智能开关、智能门锁、环境传感器(如温湿度传感器)的导线连接;
  • 便携式医疗设备:小型监护仪、血糖仪、雾化器等设备的内部低功率电路;
  • 汽车电子辅助系统:仪表盘小模块、车门控制单元、后视镜调节模块的信号传输;
  • 消费电子周边:小型打印机、蓝牙音箱、智能穿戴设备(如智能手表充电模块)的内部导线连接。

五、性能优势总结

  1. 紧凑适配:MX 2.0mm间距设计,适合高密度电路布局,满足电子设备小型化、轻量化趋势;
  2. 压接可靠性:压接式端子可实现导线与触头的机械锁合,避免焊接带来的虚焊、热损伤风险,批量生产一致性高;
  3. 环境适应性:结合铜合金与锡镀层特性,可在-40℃至85℃(MX系列常规工作温度范围)内稳定工作,适配多数民用/工业场景;
  4. 系列兼容性:与DuraClik MX 2.0系列的连接器壳体(如560124系列壳体)完全兼容,便于系统级设计与统一采购;
  5. 成本效益:标准化设计与成熟工艺,在保证性能的前提下降低整体连接方案的物料与组装成本。

该端子作为DuraClik MX 2.0系列的基础组件,通过优化的材质、参数与工艺,为紧凑空间内的可靠连接提供了高性价比的解决方案。

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