WMSIC Electronic Components

MOLEX 39000048

Model39000048
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
MOLEX 39000048
Type
MOLEX
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
39000048
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.157g
Electronic Component
1
Electronic Component
BM0265630993
AWG
22~28
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
600V
Electronic Component
Electronic Component
Electronic Component
6000
(OD)
0.9mm~1.8mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 39000048 压接公触芯产品概述

一、产品核心定位与系列归属

MOLEX 39000048 是Mini-Fit Jr.系列的压接式公触芯,专为22AWG导线设计,适配Mini-Fit Jr.系列外壳(如5558系列),聚焦中小功率电气连接领域。产品主打「可靠连接、易安装、工业级耐用性」,广泛服务于工业自动化、医疗设备、通信基站等多行业的内部线束连接需求,是替代传统焊接连接的高效解决方案。

二、关键技术参数与性能指标

类别 具体参数 备注 导线适配性 线规:AWG 2228;绝缘外径:0.91.8mm 覆盖常见中小线径导线,容错性强 电气性能 额定电压:600V(AC/DC通用);接触电阻≤10mΩ(典型值) 满足工业级高压传输需求,低损耗 材料与镀层 触头主体:黄铜;表面镀层:锡(厚度≥2μm) 平衡导电性、耐腐蚀性与焊接兼容性 机械性能 插拔寿命≥500次;导线拉脱力≥100N(典型值) 抗振动/冲击,适合严苛环境

三、核心设计特点

1. 双区压接结构

采用「导体区+绝缘区」双压接设计:

  • 导体区:直接压紧铜芯,确保低接触电阻;
  • 绝缘区:固定导线绝缘层,分散拉脱应力,避免导线断裂。
    此设计可提升压接可靠性30%以上(对比单区压接)。

2. 锡镀层工艺优势

锡镀层均匀覆盖触头表面,兼具三大优势:

  • 耐腐蚀性:抵抗潮湿、盐雾(符合IEC 60068-2-11盐雾测试);
  • 焊接兼容性:若需补焊,可直接焊接无需额外处理;
  • 接触稳定性:避免铜材氧化导致的接触电阻增大。

3. 自锁式外壳适配

精准匹配Mini-Fit Jr.系列外壳的槽位,插入时触发「咔嗒」自锁声,防止意外脱落;同时兼容不同品牌Mini-Fit Jr.外壳(需确认外壳型号匹配)。

4. 线径容错设计

允许绝缘外径在0.91.8mm范围内波动,适配国产/进口2228AWG导线,降低选型限制与库存成本。

四、典型应用场景

1. 工业自动化设备

  • 应用:PLC控制器、伺服驱动器、变频器的内部功率连接;
  • 优势:600V额定电压满足13A(22AWG)电流传输,抗振动性能适配工厂车间的机械应力。

2. 医疗诊断仪器

  • 应用:超声设备、监护仪的内部线束;
  • 优势:锡镀层无有害物质,符合医疗设备对生物相容性的基本要求,耐消毒环境腐蚀。

3. 通信基站设备

  • 应用:电源模块、射频单元的内部连接;
  • 优势:插拔寿命≥500次,适配基站设备的频繁维护需求。

4. 高端消费电子

  • 应用:变频空调、高端冰箱的控制板与执行部件连接;
  • 优势:安装效率高(压接比焊接快2~3倍),降低生产工时。

五、安装与维护注意事项

1. 压接工具要求

需使用MOLEX专用压接工具(如型号0638190000)及22AWG专用模具,确保压接尺寸符合标准:

  • 导体压接区高度:0.64±0.05mm;
  • 绝缘压接区高度:1.07±0.08mm。

2. 导线预处理

  • 剥线长度:4~5mm(过长易导致绝缘层进入导体区,过短导致接触不良);
  • 剥线方式:使用专用剥线钳,避免划伤铜芯。

3. 日常维护

  • 定期检查触芯是否松动、镀层是否磨损;
  • 避免油污、粉尘附着(可使用无水酒精擦拭触头);
  • 若发现接触电阻增大(>50mΩ),需更换触芯。

六、总结

MOLEX 39000048 作为Mini-Fit Jr.系列的核心触芯,以「高可靠压接、宽适配性、工业级耐用性」为核心优势,覆盖多行业中小功率连接需求。其设计既满足量产效率,又兼顾严苛环境下的稳定运行,是替代传统焊接的成熟解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.