WMSIC Electronic Components

MOLEX 5016481000

Model5016481000
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 5016481000
Type
MOLEX
Unit
Electronic Component
Minimum package
16000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5016481000
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.152g
Electronic Component
1
Electronic Component
BM0264336477
AWG
26~28
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
16000
Electronic Component
0.079~0.136

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 5016481000 压接插座产品概述

一、产品核心定位与基本属性

MOLEX 5016481000是一款小型压接式母端插座连接器,专为26-28AWG(美标线规)细径导线设计,属于MOLEX通用低压连接系列中的信号/小功率组件。产品以压接工艺实现电气连接,无需额外焊接,适配绝缘外径0.85-1.4mm的导线,额定电压250V,适用于多种低功率电子系统的内部紧凑连接场景。

二、关键技术参数详解

该产品参数明确且适配性强,核心指标如下:

  1. 线规适配:支持26-28AWG(对应公制0.079-0.136mm²),覆盖常见细径信号/低功率导线;
  2. 绝缘外径兼容:0.85-1.4mm,无需额外调整导线绝缘层即可匹配;
  3. 电气额定值:额定电压250V(AC/DC通用),结合线规特性,额定电流范围约1-3A(需参考官方手册确认具体负载);
  4. 触头结构:母端(Socket)设计,适配对应公端实现插拔连接;
  5. 材料镀层:触头基体为高导电铜合金,表面镀锡,兼顾耐氧化与低接触电阻。

三、触头材料与镀层特性

触头采用铜合金(磷青铜/黄铜) 基体,平衡导电性与机械强度:铜合金低电阻率减少信号损耗,弹性抗变形能力适配多次插拔;表面纯锡镀层带来三大优势:

  • 耐氧化:避免触头长期暴露于空气/湿度中产生氧化层,维持稳定接触电阻;
  • 低阻抗:减少信号衰减,适合低功率信号传输;
  • 工艺兼容:若需辅助焊接,锡镀层提升焊接牢固性,避免虚焊。

四、典型应用场景

因线径细、额定值适配低功率,该产品广泛用于:

  1. 消费电子内部连接:便携式蓝牙音箱、智能手环的内部信号导线连接,适配小空间需求;
  2. 汽车电子辅助电路:仪表盘传感器(温度、油量)的低功率信号传输,压接抗汽车振动;
  3. 工业控制小信号:小型PLC的I/O端子、传感器节点连接,适配批量生产效率;
  4. 医疗设备组件:小型监护仪内部导线连接,符合低功率稳定传输要求。

五、压接工艺与可靠性优势

压接是核心工艺,相比焊接具备明显优势:

  1. 批量效率高:无需加热,专用工具快速完成连接,适合大规模组装;
  2. 抗振可靠:机械变形紧密结合,抗振动/冲击能力优于焊接(移动场景适配性强);
  3. 无热损伤:避免焊接高温损坏绝缘层/镀层,延长产品寿命;
  4. 操作便捷:剥线→插入→压接三步完成,对操作人员技能要求低。

六、选型与使用注意事项

  1. 导线匹配:严格选用26-28AWG导线,过粗/过细均会导致接触不良;
  2. 工具专用:需用MOLEX对应压接钳,避免通用工具压接变形不均;
  3. 公端搭配:选择MOLEX同系列公端(如Mini-Fit/Micro-Fit),确保尺寸/参数匹配;
  4. 环境防护:潮湿/腐蚀环境需配合密封外壳,避免镀层腐蚀。

该产品以紧凑设计、稳定压接性能,成为低功率电子系统内部连接的实用选择,适配多种行业的批量生产需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.