WMSIC Electronic Components

MOLEX 5054311100

Model5054311100
PackageTerminal Block
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 5054311100
Type
MOLEX
Unit
Electronic Component
Minimum package
23000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5054311100
Electronic Component
1
Package
Terminal Block
Electronic Component
Terminal Block
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264457515
AWG
26~30
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
23000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 5054311100压接插座产品概述

一、产品定位与基本属性

MOLEX 5054311100是一款压接式插座连接器触头,专为26-30AWG细规格导线设计,属于小型化电气连接组件。该产品聚焦低压电路的可靠信号/电力传输,适配绝缘外径0.78-1.02mm的导线,凭借铜合金基底+镀金镀层的组合,实现机械强度与电气性能的平衡,广泛应用于消费电子、通信、工业控制等领域的内部连接场景。

二、核心技术参数详解

5054311100的参数设计精准匹配细导线应用需求,关键参数如下:

  • 线规兼容性:支持26-30AWG(对应0.049-0.136mm²)导线,覆盖当前小型电子设备常用的细规格导线,无需额外适配不同线径的触头;
  • 绝缘外径适配:仅兼容0.78-1.02mm绝缘层的导线,此范围经过优化——压接时既能保证绝缘层与触头的紧密贴合,又可避免绝缘层过度挤压导致导线损伤,或间隙过大引发短路风险;
  • 触头材料与镀层:基底采用铜合金(符合MOLEX标准),具备良好导电率与机械韧性;表面镀金镀层显著提升耐腐蚀性(抗盐雾、潮湿)、抗氧化性,同时降低接触电阻至稳定范围,减少信号衰减与功率损耗;
  • 额定电压:50V直流/交流额定电压,满足低压电路(≤50V)的电气安全要求,适用于多数小型电子设备的内部供电与信号传输。

三、设计与性能优势

  1. 压接可靠性:针对细导线优化的压接结构(如精准尺寸匹配、双压接设计),压接后导线与触头的机械连接牢固,接触电阻波动小,可通过振动、温度循环等可靠性测试;
  2. 镀层耐用性:镀金镀层厚度符合行业标准,长期使用中不易磨损,即使在多尘、潮湿环境下仍能保持稳定电气接触,延长产品使用寿命;
  3. 小型化适配:结构紧凑,与细导线尺寸匹配,适合高密度安装场景(如小型设备内部狭小空间),符合电子设备“轻、薄、小”的发展趋势;
  4. 机械稳定性:铜合金触头具备弹性,插拔过程中可缓冲应力,避免触头变形或断裂,支持多次插拔使用(满足常规应用需求)。

四、典型应用场景

5054311100的参数与设计使其适用于以下场景:

  • 消费电子:智能手环、蓝牙耳机、便携式音箱等小型手持设备的内部信号/电力连接;
  • 通信终端:家用路由器、交换机、光纤猫等设备的内部模块连接,实现稳定信号传输;
  • 工业控制:小型传感器(温度、压力传感器)、微型执行器的低压信号连接,适应工业环境轻度恶劣条件;
  • 汽车电子:车载小型模块(仪表盘传感器、车载蓝牙模块)的内部导线连接(需确认汽车级额外要求,但基础参数可支持此类场景)。

五、品牌与品质保障

MOLEX作为全球领先的连接器解决方案提供商,5054311100遵循严格质量控制体系:从原材料采购到生产、测试均符合ISO国际标准,产品一致性好、可追溯性强;同时符合RoHS环保指令,不含铅、镉等有害物质,满足全球市场环保要求,为客户提供可靠、合规的连接解决方案。

该产品凭借精准的参数设计与稳定的性能,成为小型电子设备内部连接的常用选择,可有效解决细导线压接的可靠性难题。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.