WMSIC Electronic Components

MOLEX 901190109

Model901190109
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
MOLEX 901190109
Type
MOLEX
Unit
Electronic Component
Minimum package
20000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
901190109
Electronic Component
1
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0264913525
Electronic Component
Electronic Component
Electronic Component
20000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 901190109 连接器产品概述

MOLEX 901190109是一款专为小线径电缆设计的连接器端子,属于MOLEX常规信号/电源连接系列,以宽适配性、可靠触头性能为核心特点,广泛适用于紧凑空间的电子设备内部连接场景。

一、产品核心定位与基础属性

该产品定位为中低电流信号/电源连接端子,针对2224AWG线径电缆设计,适配绝缘外径1.02mm1.47mm的绝缘层,触头采用磷青铜材质并镀锡处理,是MOLEX针座(如5557、5559系列)的配套组件,主要实现电缆与电路板/模块的可靠电气连接。

二、关键技术参数详解

1. 电缆适配范围

  • 线规:覆盖22AWG(导体直径≈0.643mm)至24AWG(导体直径≈0.511mm),兼容小型电子设备常用线径;
  • 绝缘外径:1.02mm~1.47mm,适配PVC、XLPE等常规绝缘材质,避免绝缘过粗压接困难或过细间隙过大。

2. 触头性能参数

  • 材质:磷青铜(C5191/C5210),弹性回复性优异,耐疲劳性能强,可承受多次插拔;
  • 镀层:表面镀锡(Sn),镀层厚度2~5μm(符合MOLEX标准),接触电阻典型值<10mΩ,抗氧化能力强;
  • 电流承载:22AWG持续承载≈3A,24AWG≈2A,满足常规电子设备功率需求。

3. 结构匹配性

配套MOLEX 5557/5559系列针座(间距2.54mm),端子尺寸与针座插孔精准配合,确保插拔机械稳定性。

三、产品设计优势

1. 宽范围适配性

无需为22~24AWG线径单独采购端子,减少库存种类与管理成本,适合多型号设备生产。

2. 触头可靠性

磷青铜弹性保证紧密接触,避免振动导致接触不良;锡镀层低电阻+抗氧化,常规环境下稳定工作超10年(MOLEX可靠性测试数据)。

3. 小型化与易操作性

适配2.54mm间距针座,适合小型设备内部空间;搭配MOLEX专用压接工具(如11-03-0044压线钳),快速完成压接,提升生产效率。

四、典型应用场景

1. 消费电子

  • 小型家电:加湿器、空气净化器的传感器与控制板连接;
  • 移动配件:蓝牙耳机充电盒、智能手环的内部电源连接。

2. 工业控制

  • 小型传感器:温度、压力传感器的信号输出;
  • 微型PLC:输入/输出接口连接。

3. 汽车电子

  • 低压辅助系统:车内氛围灯、小仪表的电源/信号连接(需符合汽车级环境测试)。

4. 通信设备

  • 小型路由器、交换机的内部电源分配与信号连接。

五、使用注意事项

  1. 针座适配:仅可配合MOLEX 5557/5559系列针座,避免跨品牌配合导致性能不匹配;
  2. 压接工具:使用MOLEX专用压线钳,确保导体与绝缘部分压接力度达标,避免断裂或压伤;
  3. 环境限制:锡镀层不适合长期暴露在>100℃高温或>90%RH高湿度环境,需额外防护;
  4. 插拔次数:常规插拔≈500次,频繁插拔场景需评估触头疲劳风险。

该产品凭借高适配性、可靠性能与紧凑设计,成为小型电子设备内部连接的常用选择,满足多数常规应用需求。

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