WMSIC Electronic Components

MOLEX 2064600021

Model2064600021
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 2064600021
Type
MOLEX
Unit
Electronic Component
Minimum package
12000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
2064600021
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.13g
Electronic Component
1
Electronic Component
BM0264913528
AWG
20~24
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
600V
Electronic Component
Electronic Component
Electronic Component
12000
(OD)
1.85mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 2064600021 MICRO-FIT PLUS系列母端压接端子产品概述

一、产品定位与系列基础

MOLEX 2064600021是MICRO-FIT PLUS系列连接器的核心母端压接端子,该系列以「小尺寸高密度、中低压可靠传输」为设计核心,专为电子设备内部空间受限场景打造。2064600021作为适配20-24AWG线规的通用型号,兼顾电气性能与安装效率,是工业控制、消费电子等领域的常用连接方案。

二、核心参数与设计细节

该端子的关键参数及设计特性清晰明确:

  • 线规适配:支持20-24AWG导线(覆盖中小电流传输常见线径);
  • 绝缘兼容:允许导线绝缘外径最大1.85mm,避免压接时绝缘过度挤压损伤内部导体;
  • 触头材质:采用高导铜(纯度≥99.9%),导电率达98%以上,接触电阻典型值<1mΩ;
  • 镀层工艺:触头表面镀锡(厚度5-10μm),兼具耐腐蚀性与焊接兼容性;
  • 电气额定:额定电压600V(AC/DC通用),额定电流随线规变化(20AWG约13A,24AWG约5A)。

三、材料与工艺优势

  1. 高导铜基体:相比普通铜材,电阻率降低约10%,传输损耗小,适合长时间连续工作的设备(如PLC、基站子架);
  2. 锡镀层特性:有效防止触头氧化,在潮湿/轻度腐蚀环境下仍保持稳定接触;同时兼容后续焊接修复,降低维护成本;
  3. 双压接结构:端子设「导体压接区+绝缘压接区」,既保证导线与端子机械强度,又避免导体松动导致的接触不良。

四、典型应用场景

2064600021因小尺寸、高可靠性,广泛应用于:

  • 工业控制:PLC模块、伺服驱动器、传感器接口的内部连接(空间紧凑,需稳定传输控制信号与小功率动力);
  • 消费电子:小型家电(智能电饭煲、空气净化器)的内部线束连接,平衡成本与性能;
  • 通信设备:基站子架、光纤收发器的电源/信号连接,600V额定电压满足中压供电需求;
  • 汽车电子:车载中控、胎压传感器线束连接(需匹配-40℃~105℃工作温度)。

五、安装与可靠性要点

  1. 压接工具要求:需使用MOLEX专用压接钳(如11-03-0044),压接高度需符合规格(导体压接:1.2-1.4mm;绝缘压接:1.8-2.0mm),避免过紧断芯或过松虚接;
  2. 环境适配:常规工作温度-40℃~105℃(工业/汽车级),高温场景需确认镀金镀层版本;
  3. 兼容性注意:需与MICRO-FIT PLUS公端(如2064610021)及对应外壳(如39-01-2021)配套,确保定位键对齐,避免错插。

六、选型补充说明

若需调整线规,该系列还有适配18AWG的型号(2064600018);若需更高耐腐蚀性能,可联系MOLEX定制镀金版本。选型时需重点核对导线绝缘外径是否≤1.85mm,避免绝缘过厚导致端子无法装入外壳。

该端子凭借紧凑设计与稳定性能,成为多领域中低压连接的实用选择,尤其适合对空间、可靠性有双重要求的场景。

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