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MOLEX 508028000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- MOLEX 508028000
- Type
- MOLEX
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 508028000
- Electronic Component
- 1
- Package
- Molex 50802-8000
- Electronic Component
- Terminal Block
- Electronic Component
- 0.157g
- Electronic Component
- 1
- Electronic Component
- BM0264888442
- AWG
- 22~28
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- (OD)
- 1.15mm~1.9mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Molex 50802-8000 压接端子产品概述
一、产品基本定位
Molex 50802-8000是一款小型化压接端子，隶属于Molex连接器产品线，专为电子设备内部的导线与连接器外壳连接设计。该端子采用紧凑结构，适配Molex对应系列的连接器外壳（如50801系列），可实现导线的可靠压接与信号/电力传输，满足消费电子、汽车电子等领域对小型化、高可靠性连接的需求。
二、核心技术参数详解
线规与绝缘适配
支持AWG 2228号铜芯导线，对应绝缘层外径范围为**1.15mm1.9mm**，覆盖常见小型导线规格，避免绝缘层过厚导致压接变形或过薄导致导线松动。触头核心参数
- 材质：磷青铜（Phosphor Bronze），兼具优异弹性、导电性与耐腐蚀性，长期使用可保持稳定接触压力；
- 镀层：表面镀锡（Tin），厚度符合Molex标准，有效防止触头氧化，典型接触电阻≤10mΩ；
- 电气性能：额定电流3A（AC/DC），额定电压250V（AC/DC），满足小型设备传输需求；
- 机械性能：压接后导线保持力≥10N，抗振动脱落性能优异。
三、关键材料与工艺特性
磷青铜触头的优势
磷青铜含磷成分可提升材料弹性极限与耐疲劳性，即使在振动环境（如汽车行驶）中，也能保持触头与导线的紧密贴合；同时导电性接近纯铜，降低传输损耗。锡镀层的作用
锡镀层不仅防止触头氧化，还能在压接时增强端子与导线的贴合度，减少接触电阻；此外，锡镀层与焊料兼容性好，部分场景可支持二次焊接。冷压接工艺
无需焊接，通过Molex专用压接工具（如63811系列压接钳）即可完成操作，压接效率高、一致性好，适合批量生产。
四、适配性与兼容性说明
外壳适配
需配合Molex 50801系列连接器外壳（如50801-8000）使用，两者结构匹配，实现端子在外壳内的可靠定位与锁定。导线要求
仅支持PVC绝缘铜芯导线（符合AWG 2228、绝缘外径1.151.9mm），不建议使用铝芯导线或PE/XLPE绝缘导线，避免压接质量下降。工具要求
必须使用Molex认证的专用压接工具，模腔需匹配22~28AWG规格，否则可能导致压接过紧（损伤导线）或过松（接触不良）。
五、典型应用领域
- 消费电子：智能手机、平板、智能穿戴的电池连接、主板与模块间信号传输；
- 汽车电子：车载小型传感器（温度/压力）、ECU辅助模块的导线连接，适应振动环境；
- 工业控制：小型PLC、传感器接口、仪器仪表的内部连接；
- 医疗设备：小型监护仪、便携式医疗设备的内部连接，符合低干扰要求。
六、产品优势总结
- 小型化设计，适配紧凑空间；
- 磷青铜+锡镀层组合，长期可靠；
- 宽线规范围，适配多种导线；
- 冷压接工艺，操作便捷；
- 与Molex外壳完全兼容，系统可靠性高。
该端子是Molex针对小型电子设备连接的经典产品，广泛应用于各行业对高可靠性小型连接的需求场景。
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