WMSIC Electronic Components

MOLEX 1053002300

Model1053002300
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 1053002300
Type
MOLEX
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
1053002300
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.109g
Electronic Component
1
Electronic Component
BM0264913529
AWG
20~22
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
15000
(OD)
1.6mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 1053002300 压接端子产品概述

MOLEX 1053002300是一款针对20-22AWG线缆设计的压接式端子,以高导铜触头搭配镀金镀层为核心,具备稳定的电气性能与环境适应性,广泛应用于工业、消费电子等多领域的信号及功率传输场景。

一、产品基本定位与核心参数

该端子属于压接连接器组件,核心功能是实现线缆与连接器外壳的可靠连接,核心参数明确:

  • 适配线规:2022AWG(美国线规,对应导体截面积约0.520.64mm²)
  • 允许绝缘外径:最大1.6mm(适配该线规下常规绝缘层厚度的线缆)
  • 触头材质:高导铜(确保低电阻与高导电效率)
  • 触头镀层:金(提升耐腐蚀性与接触可靠性)
  • 额定电压:250V(适用于中低压电气系统)

二、触头设计与材料特性

  1. 高导铜触头:选用高纯度铜合金,导电率优于普通铜材,可降低信号传输损耗与功率发热,适合需要稳定电气性能的场景,避免因电阻过高导致的能量损失。
  2. 镀金镀层:触头表面采用镀金处理,厚度满足防腐蚀与低接触电阻需求——镀金层可有效抵御湿度、盐雾等环境因素侵蚀,减少接触点氧化,保障长期连接可靠性;同时,镀金层的低摩擦特性适合多次插拔操作,避免触头磨损。
  3. 压接结构设计:端子压接区域采用针对性设计,分为导体压接区与绝缘压接区,可适配20-22AWG线缆的导体与绝缘层,压接后能牢固固定线缆,避免松动或接触不良。

三、适配线缆与安装要求

  1. 适配线缆类型:需选用20~22AWG的电子线缆,且线缆绝缘层外径不超过1.6mm(注意:屏蔽线需确认绝缘层外径是否符合要求,部分带屏蔽层的线缆可能需调整选型)。
  2. 安装方式:采用压接工艺,需配合专用压接工具(建议使用MOLEX原厂配套工具,如105300系列端子专用压接钳),确保压接压力与精度符合标准,避免压接过松(接触不良)或过紧(损伤线缆/端子)。
  3. 剥线长度:线缆剥线时需控制导体暴露长度(通常需匹配端子压接区尺寸,具体可参考MOLEX官方安装手册),确保导体完全进入触头压接区,绝缘层与端子绝缘压接部分紧密贴合。

四、性能优势与可靠性表现

  1. 电气性能稳定:高导铜触头与镀金镀层组合,使接触电阻保持在较低水平,250V额定电压可满足多数低压/中低压设备的供电与信号传输需求,避免电压波动影响设备运行。
  2. 环境适应性强:镀金镀层具备良好的耐腐蚀性,可在湿度较高、轻度盐雾的环境下长期使用,适合户外或工业现场等复杂场景,无需额外防护即可保障连接可靠性。
  3. 安装效率高:压接工艺相比焊接更适合批量生产,无需加热,可避免线缆/元件热损伤,提升生产效率与一致性,降低不良率。

五、兼容性与应用领域

  1. 兼容性说明:该端子需配合MOLEX对应系列的连接器外壳(如105300系列外壳)使用,需确认外壳接口尺寸与端子匹配(可参考MOLEX官方产品手册);与同类20-22AWG压接连接器的兼容性需以实际测试为准。
  2. 典型应用场景:
    • 工业控制:PLC(可编程逻辑控制器)、传感器、执行器的内部连接;
    • 消费电子:家电(如洗衣机、空调)内部的信号与电源连接;
    • 汽车电子:车载辅助系统(如倒车雷达、中控屏)的低压连接;
    • 通信设备:小型路由器、交换机的内部线缆连接;
    • 医疗设备:小型医疗仪器(如监护仪)的内部可靠连接(镀金镀层符合医疗设备对耐腐蚀的要求)。

六、使用注意事项

  1. 避免端子表面镀金层刮伤,安装前勿用尖锐工具触碰触头,以免影响接触性能;
  2. 压接后需检查连接牢固性,可通过轻微拉拽线缆测试(勿过度用力,避免损伤线缆);
  3. 存储时需保持干燥,避免端子受潮氧化(镀金层虽抗腐蚀,但长期潮湿仍可能影响性能);
  4. 勿将端子用于超出250V额定电压的场景,以免引发安全隐患。

该端子凭借可靠的材料设计与适配性,成为多领域中低压连接的实用选择,可满足批量生产与长期使用的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.