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MOLEX 503948055
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- MOLEX 503948055
- Type
- MOLEX
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 503948055
- Electronic Component
- 1
- Electronic Component
- Crimp Terminal
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0264888438
- AWG
- 24~30
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Electronic Component
- 0.049~0.22
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
503948055 产品概述
一、产品概览
503948055 是 MOLEX 面向高密度线对板连接应用的 crimp 端子，描述为 Contact F Crimp ST Cable Mount 24-30AWG Milli-Grid（卷轴包装）。该端子适配 AWG 24–30（截面积约 0.049–0.22 mm²）范围的导线，设计用于 Milli‑Grid 系列连接系统，支持高速自动化加工与高密度布线场景。
二、主要参数与结构特点
- 导线范围：AWG 24–30，等效截面积 0.049–0.22 mm²，兼容细股或多股软铜线。
- 安装方式：Cable‑mount crimp 端子，卷轴（reel）包装，便于自动上料与高速压接设备。
- 接触功能：用于与 Milli‑Grid 插针/接触件配合，实现可靠的电气接触与机械锁定。
- 结构要点：压接区与绝缘支撑区分明，保证导线机械强度与电气可靠性；端子形貌适配插入式端座以确保定位与锁紧。
三、材料与表面处理（常见选项）
- 基体材料：常用铜合金（如黄铜、磷铜）以兼顾延展性与导电性。
- 表面处理：典型为镀锡或镀金（视应用性能要求而定），以降低接触电阻并提升耐腐蚀性。
（具体材质与镀层请以 MOLEX 出厂资料为准）
四、装配与工艺建议
- 压接设备：建议使用厂家推荐模具与压力参数，卷轴包装适合自动压接机与端子上料器。
- 质量检验：压接后建议做拉力测试、接触电阻测量及外观检查；关键点为导线支撑、无毛刺、无过压变形。
- 线缆准备：按 MOLEX 指定剥线长度与导线整理要求操作，避免超长剥皮或多余导线暴露影响绝缘与耐振性。
五、典型应用场景
- 高密度线对板连接：计算设备、通信设备、测试仪器等需要紧凑布线的场合。
- 工业与消费电子：控制模块、传感器连接及内部互联。
- 量产自动化装配：卷轴包装便于贴片式上料与高速压接，适合大批量生产线。
六、储存与质量控制建议
- 存放环境：干燥、防尘、防腐蚀；避免强酸强碱及高湿环境。
- 追溯管理：建议记录批号、生产日期与入库检验记录，便于质量追溯与失效分析。
- 符合性：在采购前确认是否满足特定法规或客户要求（如 RoHS、REACH 等）。
七、配套与选购建议
- 配套件：采购时同时确认与之配合的 Milli‑Grid 外壳/插针型号，以保证几何互换性。
- 样件验证：建议先进行样件试装与电气机械性能验证，再进入量产采购。
- 技术支持：如需压接参数、剥线长度及模具选择，可向 MOLEX 或代理商索取详细安装说明与推荐清单。
综上，503948055 为面向高密度、自动化装配需求的 crimp 端子，适用 24–30 AWG 线规，卷轴供料有利于提升产线效率与装配一致性。选型与使用时请结合实际线缆特性和 MOLEX 的压接规范进行验证。
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