Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MOLEX 430250800
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MOLEX 430250800
- Type
- MOLEX
- Minimum package
- 2500 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 430250800
- Electronic Component
- 1
- Package
- P=3mm
- Electronic Component
- 2
- Electronic Component
- (Wire-to-Board / Wire-to-Wire)
- Electronic Component
- 3mm
- Electronic Component
- 0.773g
- Electronic Component
- 3mm
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- Micro-Fit(MX 3.0)
- Electronic Component
- BM69415323
- Electronic Component
- PA
- Operating Temperature
- 40℃~+105℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MOLEX 430250800 微型连接器
一、产品简介
MOLEX 430250800 是一款胶壳连接器产品，采用了Micro-Fit（MX 3.0）设计，具有2x4P的插针排列，间距为3mm。这种连接器广泛应用于各种电子设备中，尤其是在空间有限的环境中，凭借小巧的体积和高效的连接性能，成为多种行业中不可或缺的设备组件。
二、产品特性
- 高密度设计：Micro-Fit系列连接器的设计允许在较小的空间内实现高密度连接，适合紧凑型设备使用。
- 可靠性：MOLEX 430250800 采用高质量材料制造，具有优良的耐热性和抗老化性能。其接触系统经过精密设计，确保连接的稳定性和可靠性。
- 易于安装：该连接器使用压接（Crimp）封装，具有简便的安装流程，无需焊接，可以快速连接与断开，适合大规模生产。
- 多样化的应用：由于其稳定的电气性能，430250800连接器被广泛用于汽车电子、消费电子、工业设备、数据通信等多个领域。
三、技术规格
- 电气参数：颗粒阻抗较低，能够保证信号在高速传输时不失真，同时支持较高的额定电流，确保设备安全运行。
- 机械性能：连接器的设计强化了抗插拔力，减少了使用过程中的机械损伤，提高了使用的耐久性。
- 温度范围：适用的工作温度范围通常在-40°C至+105°C，使得该连接器可以应对各种严苛的工作环境。
四、应用场景
MOLEX 430250800 适合多种场合使用，尤其是在以下领域表现出色：
- 汽车电子：在现代汽车中，越来越多的功能依赖于电子设备，430250800连接器的高密度设计和高可靠性使其适合于汽车内部仪表、座椅控制和门控制等功能模块。
- 消费电子：如便携式音频播放器、数码相机及各类家用电器中，使用该连接器可缩短产品的设计时间和生产周期。
- 工业自动化：在工业设备及机器人技术中，430250800为传感器、控制模块等提供稳定的电气连接，确保设备的高效运作。
- 计算机网络：在网络交换机、路由器和存储设备中，也可见到此连接器的应用，确保数据传输的稳定性。
五、总结
MOLEX 430250800 微型连接器因其卓越的设计和可靠的性能，成为电子行业中非常重要的连接元件。它不仅满足了密集型设备的连接需求，还通过高稳定性支持复杂系统的高效运行。该产品的灵活应用和简易安装，使其成为设计工程师和制造商的优选解决方案，推动了多个行业的创新和发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
