WMSIC Electronic Components

MOLEX 105300-1100

Model105300-1100
PackageReel
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
MOLEX 105300-1100
Type
MOLEX
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
105300-1100
Electronic Component
1
Package
Reel
Electronic Component
Terminal Block
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0209122597
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MOLEX 105300-1100 Nano-Fit Crimp Terminal

产品简介

MOLEX 105300-1100 是一款高性能的 Nano-Fit 压接端子,专为 24-26 AWG 线规设计,采用 2.54µm 的无铅哑光锡(Sn)镀层。此端子作为电子连接解决方案,在不同的应用场景中都表现出优异的连接性能,具备优良的导电性、耐腐蚀性和机械强度。

应用场景

MOLEX 105300-1100 端子广泛应用于多个行业,例如:

  • 消费电子:用于智能手机、平板电脑、电视机等便携式设备的内部连接。
  • 汽车电子:可以在汽车电气系统中使用,例如车载音响、导航系统和动力管理系统。
  • 工业设备:在工业自动化设备、机器人和控制系统中,提供稳定的电气连接。
  • 医疗设备:可用于各种医疗仪器和设备,确保信号传输的准确性和可靠性。

设计特点

  1. 压接设计:端子采用独特的压接结构,使其能够与导线形成牢固且持久的机械连接,保证良好的电气性能。

  2. 微型化设计:Nano-Fit 系列旨在满足现代电子设备对空间的需求,具有较小的尺寸,适合高密度安装。

  3. 镀锡处理:2.54µm 哑光锡镀层不仅提高了抗腐蚀性能,还增强了导电性,确保在各种环境下都能稳定工作。

  4. 高品质材料:MOLEX 使用高导电性的合金材料,确保在高电流条件下依然能够维持低的接触电阻。

性能参数

  • 适用线规:此端子能够支持 24-26 AWG 的电缆,适用范围广泛。
  • 额定电流:根据具体的连接方式和安装环境,端子的额定电流性能能够达到良好的标准,适合大多数应用需求。
  • 温度范围:端子的工作温度范围通常在 -40°C 到 +125°C,适合多种环境条件。

安装与使用

MOLEX 105300-1100 端子的安装简单且高效,通常可以利用专业的压接工具完成。为了确保连接的可靠性,建议在安装过程中按照厂家的规格和指导进行操作。此外,用户在使用前应检查端子的状态,确保没有物理损坏或污染。

可靠性与合规性

作为行业内知名的电子元件品牌,MOLEX 确保其产品符合国际标准,经过严格的测试和认证,确保每一件产品的质量和性能。此系列端子符合 RoHS(限制使用某些有害物质指令)、REACH(化学品注册、评估、许可和限制)等环保控制规范,确保用户在采购使用时的安心。

总结

MOLEX 105300-1100 Nano-Fit Crimp Terminal 是一款高效、可靠且灵活的电子连接组件,适用于多种行业和场景。其微型化设计、优质材质和无铅环保处理使之成为现代电子产品中理想的选择,无论是在消费品、工业设备还是医疗器械中,都能发挥其卓越的性能和可靠性,帮助工程师和设计师实现高效的连接解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.