WMSIC Electronic Components

MOLEX 39012025

Model39012025
PackageP=4.2mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MOLEX 39012025
Type
MOLEX
Minimum package
11000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
39012025
Electronic Component
1
Package
P=4.2mm
Electronic Component
2
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
4.2mm
Electronic Component
0.75g
Electronic Component
4.2mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0264888451
Electronic Component
PA
Operating Temperature
40℃~+105℃
Socket
2x1P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 39012025 线对板/线对线胶壳产品概述

一、产品核心定位

该产品是MOLEX推出的小间距紧凑型线对板/线对线连接胶壳,针对对空间紧凑性要求较高的电路连接场景设计,以2×1P的极简排针布局实现稳定可靠的单路或双路信号/电源传输,属于MOLEX标准连接组件系列中的实用型产品。

二、基础规格参数详解

产品核心参数均符合MOLEX原厂标准,关键指标如下:

  • 连接结构:2排×1PIN(2x1P),单排单PIN的紧凑布局,大幅减少占用空间;
  • 间距规格:引脚中心距(Pitch)4.2mm,排与排之间的行距同步为4.2mm,适配同系列端子的精准定位;
  • 外观与材质:白色PA(聚酰胺)塑料胶壳,PA材质兼具耐冲击、电气绝缘性与加工稳定性;
  • 安全与环境性能:阻燃等级达UL94V-0(自熄性,防止火焰蔓延),工作温度范围-40℃~+105℃,可适应宽温环境;
  • 品牌与型号:MOLEX原厂出品,型号为39012025,属于其通用连接组件系列。

三、结构设计特点

  1. 紧凑布局优化:2×1P的排针设计将传统多PIN胶壳的空间压缩至最小,适合小型化设备(如智能穿戴、微型传感器)的内部连接;
  2. 精准插孔定位:胶壳内部插孔采用模具一体成型,公差控制严格(典型公差±0.05mm),确保端子插入时的同轴度,避免接触不良;
  3. 卡扣式连接结构:适配对应端子/胶壳的卡扣设计,插拔时具有明显的“咔嗒”锁定感,防止振动环境下的松脱(如汽车电子、工业设备场景)。

四、材料与性能优势

  • PA材质的综合优势:聚酰胺(PA)塑料具有良好的机械强度(耐冲击、抗拉伸),长期使用不易变形;同时具备优异的电气绝缘性,绝缘电阻典型值≥1000MΩ,满足低压电路的绝缘要求;
  • UL94V-0阻燃保障:符合国际安全标准的阻燃等级,在电路短路等异常情况下可快速自熄,避免火灾风险扩散;
  • 宽温适应性:-40℃~+105℃的工作范围覆盖了大多数工业、汽车及消费电子的环境温度(如北方户外设备、高温厨房家电),无需额外防护即可稳定工作。

五、适配与兼容性说明

该胶壳需配合对应端子与焊针使用,适配范围如下:

  • 线对板应用:适配MOLEX同间距(4.2mm)的PCB焊针组件,焊针可通过波峰焊或回流焊固定于电路板,胶壳通过端子与焊针实现连接;
  • 线对线应用:可与同规格(2×1P、4.2mm间距)的对插胶壳配合,实现两端线缆的直接连接;
  • 端子适配:建议搭配MOLEX同系列的压接端子(线径范围22~28AWG),确保压接后的端子与胶壳插孔的紧密配合,减少接触电阻(典型接触电阻≤10mΩ)。

六、典型应用领域

MOLEX 39012025的紧凑结构与宽温性能使其适用于多个场景:

  • 消费电子:智能手环、蓝牙耳机等小型穿戴设备的内部信号连接;小型家电(如加湿器、智能台灯)的控制电路连接;
  • 工业控制:微型传感器(温度、压力传感器)与控制器的信号传输;小型PLC模块的辅助电路连接;
  • 汽车电子:低功耗辅助系统(车内氛围灯、传感器模块)的电路连接,适应车内-40℃~+85℃的温宽;
  • 通信设备:小型路由器、交换机模块的内部连接,满足紧凑空间的布线需求。

该产品以高性价比、稳定可靠的性能,成为小型化电路连接场景的常用选择,符合MOLEX对工业级连接组件的质量要求,可广泛替代同类通用胶壳产品。

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