WMSIC Electronic Components

MOLEX 532610371

Model532610371
PackageSMD, P=1.25mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 532610371
Type
MOLEX
Unit
Electronic Component
Minimum package
1600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
532610371
Electronic Component
1
Package
SMD, P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.152g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
3P
Electronic Component
1
Electronic Component
PicoBlade(MX 1.25)
Electronic Component
BM0230286004
Electronic Component
PA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 532610371 线对板针座产品概述

MOLEX 532610371是一款针对紧凑空间设计的线对板针座,属于MOLEX经典PicoBlade(MX 1.25)系列,核心定位为小间距、高可靠的板端连接解决方案,适用于消费电子、汽车电子等对尺寸敏感的应用场景。

一、产品定位与系列背景

PicoBlade系列以1.25mm超小间距为核心特点,是MOLEX针对微型电子设备连接需求开发的产品线。532610371作为该系列的1×3P卧贴型号,重点解决小尺寸、表面贴装工艺下的稳定连接问题,适配高密度PCB布局,替代传统大间距连接器的空间占用。

二、结构规格与尺寸参数

该针座采用单排3针设计,核心尺寸严格匹配PicoBlade系列的紧凑要求:

  • 针间距:1.25mm(行业小间距标准,适配微型线端连接器对接);
  • 安装方式:卧贴(SMD),支持自动化SMT工艺,提升生产效率;
  • 空间尺寸:Z轴(板上高度)仅3.4mm,X轴底边长度8.9mm,Y轴宽度5.2mm,可集成到厚度≤4mm的设备内部;
  • 附加特征:自带辅助焊脚,增强焊接强度,降低振动环境下的脱焊风险。

三、电气性能与环境适应性

电气性能满足中低功率设备的连接需求,同时兼顾宽温适应性:

  • 额定电流:1A(AC/DC通用,适配小型电机、传感器等负载);
  • 额定电压:125V(符合低电压设备安全标准);
  • 触头性能:触头材质为磷青铜(弹性优异,接触压力稳定),表面镀锡(耐氧化、易焊接,接触电阻≤10mΩ);
  • 温度范围:-40℃~+105℃,覆盖工业级环境(低温户外、高温车载)的使用需求。

四、材料与可靠性保障

材料选择兼顾强度、阻燃性与长期可靠性:

  • 塑料壳体:玻纤增强聚酰胺(PA),强度高于普通PA,抗冲击、抗变形;
  • 阻燃等级:UL94V-0(符合电子设备防火标准,防止火焰蔓延);
  • 触头镀层:锡镀层厚度符合MOLEX标准,抵御长期氧化腐蚀,确保接触稳定。

五、典型应用场景

因尺寸紧凑、可靠性高,广泛应用于:

  1. 消费电子:小型家电(手持搅拌机、智能音箱)、穿戴设备(智能手表、蓝牙耳机)内部连接;
  2. 汽车电子:车载低功耗模块(胎压监测、氛围灯控制器)线束对接;
  3. 工业控制:小型传感器节点(温湿度传感器)、微型执行器板端连接;
  4. 医疗设备:便携式仪器(血糖仪、雾化器)内部电路连接。

六、安装与兼容性优势

  • 卧贴设计:无需钻孔,直接SMT焊接,适配高密度PCB,降低设计复杂度;
  • 辅助焊脚:分散焊接应力,提升抗振性能(符合IEC 60068-2-6振动测试标准);
  • 全系列兼容:适配PicoBlade线端连接器(如MOLEX 53250系列端子),实现完整线对板方案。

总结:MOLEX 532610371凭借1.25mm小间距、卧贴安装、高可靠性等特点,成为微型电子设备板端连接的优选方案,可满足多行业对紧凑、稳定连接的需求。

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