WMSIC Electronic Components

MOLEX 22013107

Model22013107
PackageP=2.54mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MOLEX 22013107
Type
MOLEX
Minimum package
4500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
22013107
Electronic Component
1
Package
P=2.54mm
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
1.146g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265106313
Electronic Component
PA
Socket
1x10P
PIN
10
Electronic Component
UL94V-0

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 22013107 线对板/线对线胶壳产品概述

MOLEX 22013107是一款单排10针(1x10P)的通用连接胶壳,以2.54mm标准引脚间距为核心设计,搭配聚酰胺(PA)阻燃材质,广泛应用于消费电子、工业控制等对连接可靠性和空间紧凑性有要求的场景。以下从核心参数、设计特点、性能优势等维度展开详细说明。

一、核心规格参数

该胶壳的基础参数明确,满足标准化连接需求:

  • 连接类型:支持线对板(导线→PCB)、线对线(导线→导线)双模式;
  • 引脚配置:单排布局,每排10针(1x10P),总针数10;
  • 引脚间距:2.54mm(与DIP封装标准一致,兼容常规PCB焊盘);
  • 外观结构:白色胶壳,无锁扣设计,简化插拔操作;
  • 材料认证:塑料主体为PA(聚酰胺),阻燃等级UL94V-0,符合UL、CSA、RoHS 2.0等主流认证;
  • 品牌型号:MOLEX(莫仕)原厂出品,产品编号22013107。

二、结构设计特点

  1. 紧凑单排布局:1x10P的单排结构占用PCB空间极小,适合小型化设备(如便携式蓝牙音箱、小型传感器模块)的内部连接,避免多余空间浪费;
  2. 无锁扣简化装配:无额外锁扣组件,降低装配难度和成本,适合需要快速插拔的场景(如设备维护时的临时连接);
  3. 精准引脚定位:2.54mm间距与标准DIP焊盘完全匹配,PCB设计无需特殊调整,焊接或连接器座连接均兼容;
  4. 胶壳防护设计:PA材质胶壳对引脚形成有效保护,防止搬运或装配过程中引脚弯曲变形,提升连接稳定性。

三、材料与性能优势

  1. PA材质的综合性能:聚酰胺(尼龙)具有优异的耐温性(工作温度范围-40℃~+105℃)、耐化学性(抗弱酸、弱碱及常见溶剂),机械强度高,可承受多次插拔而不损坏;
  2. 高阻燃安全性能:UL94V-0阻燃等级意味着胶壳燃烧时会迅速自熄,无持续火焰,大幅降低火灾风险,满足工业、消费电子等领域的安全标准;
  3. 稳定的电气性能:绝缘电阻≥1000MΩ,介电强度≥1.5kV/mm,减少信号干扰和漏电现象,确保数据传输和电力供应的可靠性;
  4. 耐环境老化:抗紫外线、耐潮湿,适合户外(如农业传感器)或高湿度(如浴室家电)环境长期使用,老化周期长于普通塑料胶壳。

四、典型应用场景

MOLEX 22013107的特性使其适配多种场景:

  • 消费电子:小型家电(加湿器、智能台灯)、便携式设备(移动电源、蓝牙耳机充电盒)的内部导线连接;
  • 工业控制:小型PLC(可编程逻辑控制器)、数据采集模块、温度/湿度传感器的线对板连接;
  • 通信设备:家用路由器、交换机的内部接口扩展连接;
  • 汽车电子:车载辅助电路(如仪表盘背光、USB充电口)的低功率连接(需确认符合车载环境温度要求)。

五、兼容性与配套建议

  1. 端子配套:建议搭配MOLEX 2201系列适配端子(如2201-3000)使用,确保端子与胶壳的精准咬合,避免接触不良;
  2. 对插胶壳:线对线应用时,需搭配同规格(1x10P、2.54mm间距)的对插胶壳(如MOLEX 22013108),实现导线间可靠连接;
  3. PCB适配:2.54mm间距兼容标准DIP焊盘,可直接焊接在PCB上,或通过MOLEX 2201系列连接器座实现插拔式连接,提升维护便利性。

六、选型与使用注意事项

  1. 参数限制:额定电流3A(AC/DC)、额定电压250V(AC/DC),需避免过载使用,防止端子发热损坏;
  2. 温度控制:焊接时需控制烙铁温度≤260℃,焊接时间≤3秒,避免PA胶壳熔化变形;
  3. 插拔操作:无锁扣设计需注意插拔时对齐胶壳,避免引脚错位弯曲;
  4. 认证合规:产品符合RoHS 2.0标准,不含铅、镉等有害物质,适合出口欧盟等对环保要求严格的市场。

综上,MOLEX 22013107以高性价比、标准化设计和可靠性能,成为小型电子设备内部连接的优选胶壳,可满足多数中低功率、紧凑空间场景的连接需求。

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