Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MOLEX 1040310811是一款专为MicroSD(TF)卡设计的推拉式直角卡座,属于小型化、低高度的存储介质连接器。该产品依托MOLEX在连接器领域的工艺积累,聚焦便携设备的空间优化与操作便捷性需求,是消费电子、工业手持设备等领域的常用存储连接方案。其核心属性明确:适配标准MicroSD卡,采用拔插式(推拉式)连接,本体高度仅1.42mm,支持-25℃~+85℃宽温工作环境。
该产品的核心参数直接体现了应用适配性,关键指标如下:
低高度小型化
1.42mm的本体高度可显著降低设备厚度,适配智能手表、运动相机等追求轻薄的产品;紧凑尺寸不占用过多PCB空间,提升内部布局灵活性。
推拉式连接体验
避免传统插拔的卡顿问题,用户无需用力按压/拉扯即可完成卡体操作,降低MicroSD卡触点磨损风险,延长介质使用寿命。
宽温与耐久性
-25℃~+85℃的工作温度覆盖大部分消费电子与工业场景,极端环境下仍保持稳定连接;MOLEX工艺保障拔插耐久性(通常达数千次以上),满足频繁换卡需求。
直角布局优势
引脚从卡座侧面引出,适合PCB垂直/侧面安装,减少布线复杂度,适配小型化设备的紧凑布局。
安装适配性
支持标准PCB贴片安装(SMT),适配FR-4等常见板材,可通过自动化贴片机批量生产,降低组装成本。
全兼容MicroSD卡
兼容所有符合SD协会规范的卡体(含不同速度等级:Class10、UHS-I等),无需额外适配,即插即用。
热插拔支持
配合MicroSD卡的热插拔特性,用户无需关机即可更换存储介质,提升设备使用效率(如车载记录仪换卡)。
基于低高度、宽温、推拉式等优势,该产品广泛应用于:
MOLEX 1040310811以紧凑尺寸、便捷操作和宽温可靠性,成为小型化存储设备的理想连接方案。其适配性强、安装简便,可满足消费电子、工业等多领域需求,是MOLEX在便携设备连接器领域的经典产品之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products