WMSIC Electronic Components

MOLEX 1040310811

Model1040310811
PackageSMD
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 1040310811
Type
MOLEX
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
1040310811
Electronic Component
1
Package
SMD
Electronic Component
SD / Connector
Electronic Component
0.602g
Type
Micro SD
Electronic Component
1
Electronic Component
BM0264873523
Operating Temperature
25℃~+85℃
Electronic Component
Electronic Component
Connector Type
Card Socket
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 1040310811 MicroSD卡连接器产品概述

一、产品核心定位与基本属性

MOLEX 1040310811是一款专为MicroSD(TF)卡设计的推拉式直角卡座,属于小型化、低高度的存储介质连接器。该产品依托MOLEX在连接器领域的工艺积累,聚焦便携设备的空间优化与操作便捷性需求,是消费电子、工业手持设备等领域的常用存储连接方案。其核心属性明确:适配标准MicroSD卡,采用拔插式(推拉式)连接,本体高度仅1.42mm,支持-25℃~+85℃宽温工作环境。

二、关键技术参数详解

该产品的核心参数直接体现了应用适配性,关键指标如下:

  • 卡连接方式:推拉式(PUSH-PULL),插入后轻推锁定,拔出时再次轻推弹出,操作流畅无卡顿;
  • 卡类型:兼容所有标准MicroSD卡(含MicroSDHC、MicroSDXC),覆盖GB级至TB级容量;
  • 连接器类型:MicroSD板载卡座,直接焊接于PCB板;
  • 本体最大高度:1.42mm,是当前主流低高度规格,适配超薄设备内部空间;
  • 工作温度范围:-25℃~+85℃,宽温设计覆盖户外、车载等极端场景;
  • 安装布局:直角(R/A)设计,引脚垂直于卡座本体,优化PCB布线空间。

三、结构设计与可靠性优势

  1. 低高度小型化
    1.42mm的本体高度可显著降低设备厚度,适配智能手表、运动相机等追求轻薄的产品;紧凑尺寸不占用过多PCB空间,提升内部布局灵活性。

  2. 推拉式连接体验
    避免传统插拔的卡顿问题,用户无需用力按压/拉扯即可完成卡体操作,降低MicroSD卡触点磨损风险,延长介质使用寿命。

  3. 宽温与耐久性
    -25℃~+85℃的工作温度覆盖大部分消费电子与工业场景,极端环境下仍保持稳定连接;MOLEX工艺保障拔插耐久性(通常达数千次以上),满足频繁换卡需求。

  4. 直角布局优势
    引脚从卡座侧面引出,适合PCB垂直/侧面安装,减少布线复杂度,适配小型化设备的紧凑布局。

四、安装与兼容性特点

  1. 安装适配性
    支持标准PCB贴片安装(SMT),适配FR-4等常见板材,可通过自动化贴片机批量生产,降低组装成本。

  2. 全兼容MicroSD卡
    兼容所有符合SD协会规范的卡体(含不同速度等级:Class10、UHS-I等),无需额外适配,即插即用。

  3. 热插拔支持
    配合MicroSD卡的热插拔特性,用户无需关机即可更换存储介质,提升设备使用效率(如车载记录仪换卡)。

五、典型应用领域

基于低高度、宽温、推拉式等优势,该产品广泛应用于:

  1. 便携消费电子:智能手表、运动相机、蓝牙音箱(带存储)、掌机;
  2. 车载电子:车载记录仪、小型车载多媒体、导航终端;
  3. 工业手持设备:数据采集器、巡检终端、工业PDA(宽温适应户外/工业环境);
  4. 智能家居:智能摄像头(本地存储)、智能音箱(扩展存储)。

六、总结

MOLEX 1040310811以紧凑尺寸、便捷操作和宽温可靠性,成为小型化存储设备的理想连接方案。其适配性强、安装简便,可满足消费电子、工业等多领域需求,是MOLEX在便携设备连接器领域的经典产品之一。

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