Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MOLEX 430450612
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MOLEX 430450612
- Type
- MOLEX
- Minimum package
- 144 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 430450612
- Electronic Component
- 1
- Package
- Through-hole, P=3mm
- Electronic Component
- 2
- Electronic Component
- Wire-to-Board
- Electronic Component
- 3mm
- Electronic Component
- 0.157g
- Electronic Component
- 3mm
- Electronic Component
- Electronic Component
- PIN
- 6P
- Electronic Component
- 1
- Electronic Component
- Micro-Fit(MX 3.0)
- Electronic Component
- BM0000003987
- Electronic Component
- Through-hole
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：430450612 - MOLEX 线对板针座
一、基本信息
- 产品名称：线对板针座
- 品牌：MOLEX
- 系列：Micro-Fit (MX 3.0)
- 类型：插针座
- 引脚排列：2x3P
- 引脚间距：P=3mm
- 封装类型：Pin (Male)
二、产品特性
430450612作为MOLEX品牌的一款高性能线对板针座，采用直插式的结构设计，这使得其能够方便地连接至各种PCB（印刷电路板）上。该产品具有六个引脚，按照2x3的格式排列，符合Micro-Fit系列的标准，适合在有限的空间内提供高密度的连接解决方案。
耐用性： MOLEX的Micro-Fit系列以其可靠性和耐久性著称。430450612的制造材料经过严格挑选，能够承受频繁的插拔操作，而不影响接触性能，这使得其在多次使用场合中仍然能够提供优良的电气连接。
电气性能： 线对板针座的设计确保了低接触电阻和良好的导电性能，适合用于高电流应用。此外，其隔离设计使得针脚之间有足够的电气间隙，避免短路的风险。
插拔简易： 直插式结构设计使得用户在使用过程中插拔便捷，降低了操作的难度，尤其是在狭小的空间环境中，用户不需要太多的工具和技巧即可完成安装。
适用范围广： 此型号广泛应用于工业自动化、家电、通信系统等多个领域，这使得430450612成为各种电子设备中不可或缺的一部分。
兼容性： 由于该产品遵循标准化的Micro-Fit (MX 3.0)设计，能够与其他MOLEX及兼容品牌的连接器实现互换性，为工程师在设计和维护过程中的灵活性提供了保障。
三、应用场景
430450612线对板针座适用于多种不同的应用场合，包括但不限于：
- 工控设备：可以用于PLC（可编程逻辑控制器）、变频器、传感器数据采集模块等设备，提供稳固的电源和信号连接。
- 消费电子：适合智能家居产品、音响设备、个人电脑及配件等领域，满足日常高频使用的电气连接需求。
- 汽车电子：在汽车电子系统中，作为信号线连接的关键元件，提高了系统的可靠性和安全性，特别是在车载娱乐系统及导航设备中应用广泛。
四、总结
MOLEX的430450612线对板针座是连接器市场中的一款优质产品，具有突出的耐用性、良好的电气性能和广泛的适用性。其直插设计为工程师提供了极大的便利，使得在复杂的电路连接中更显得简洁高效。此外，它的标准化设计确保了与众多其他产品的兼容性，为各类电子设备的应用提供了可靠的解决方案。无论是在工业、消费电子还是汽车领域，430450612都能满足现代科技带来的各种连接要求，成为电子连接领域的重要组成部分。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
