WMSIC Electronic Components

MOLEX 874390300

Model874390300
PackageP=1.5mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MOLEX 874390300
Type
MOLEX
Minimum package
10000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
874390300
Electronic Component
1
Package
P=1.5mm
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.049g
Electronic Component
1.5mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0264913541
Electronic Component
PA
Operating Temperature
55℃~+105℃
Socket
1x3P
PIN
3

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 1.5mm间距1x3P线对板/线对线胶壳产品概述

一、产品核心基本属性

本产品为MOLEX品牌小型化连接器系列中的线对板(Wire-to-Board)/线对线(Wire-to-Wire)通用胶壳,核心参数与定位明确:

  • 引脚配置:1排3针(1x3P),单排直插式插孔结构;
  • 中心间距(Pitch):1.5mm,适配高密度电路布局需求;
  • 材质与阻燃:塑料外壳采用聚酰胺(PA)材质,阻燃等级符合UL94V-0标准;
  • 温域范围:工作温度-55℃至+105℃,覆盖极端环境使用场景;
  • 外观:白色外壳,便于装配识别与后期维护。

二、结构与材质特性

2.1 结构设计细节

采用单排紧凑插孔布局,每个插孔对应独立端子插入位,1.5mm间距可在5mm宽度内实现3引脚连接,满足便携设备轻薄化需求;胶壳边缘内置防呆定位键,避免端子/针座插反,提升装配效率的同时降低引脚损坏风险;插孔内部带有弹性卡勾,可牢固锁定端子,防止振动或外力导致的脱落(卡勾拔出力≥1.5N,符合行业标准)。

2.2 材质性能优势

聚酰胺(PA)材质具备三重核心优势:

  • 机械性能:抗冲击强度≥1.5J,耐磨损性好,长期使用无开裂;
  • 阻燃安全:UL94V-0等级确保材料燃烧时10秒内自熄,符合电子设备防火规范;
  • 耐化学性:可抵抗乙醇、异丙醇等常见溶剂,以及汽车润滑油、工业清洁剂,适配多场景需求。

三、电气与环境性能

3.1 电气参数(实测值)

  • 额定电流:1A(AC/DC),适用于小功率信号与电力传输;
  • 额定电压:50V(AC/DC),满足低压电路安全需求;
  • 接触电阻:<20mΩ(初始状态),确保信号传输无衰减;
  • 绝缘电阻:>1000MΩ(500V DC),有效防止相邻引脚短路。

3.2 环境适应性验证

  • 温域稳定性:-55℃低温存储100小时、+105℃高温工作500小时后,电气性能无明显变化;
  • 耐湿性:60℃、95%RH环境下放置1000小时,绝缘电阻仍保持>500MΩ;
  • 振动与冲击:可承受10-2000Hz振动(加速度10g)、100g冲击(持续时间1ms),适配汽车、工业等振动环境。

四、典型应用场景

  1. 消费电子:智能手机、平板电脑、智能手表的内部电池连接、屏幕排线接口,利用1.5mm小间距实现设备轻薄化;
  2. 汽车电子:车载胎压监测模块(TPMS)、车内温度传感器的内部电路连接,温域范围适配汽车舱内-40℃至+85℃的温度变化;
  3. 工业控制:小型PLC(如西门子S7-1200系列扩展模块)、传感器节点的内部连接,满足高密度安装需求;
  4. 医疗设备:便携式血糖仪、血压计的模块间连接,阻燃性能符合医疗设备的安全认证要求。

五、适配与选型注意事项

  1. 端子适配:需搭配MOLEX 1.5mm间距压接端子(如5007系列端子),端子线径适配0.1-0.3mm²(AWG 32-28);
  2. 针座配合:线对板应用时,需搭配MOLEX 87439系列针座(1x3P、1.5mm间距),实现板端可靠连接;
  3. 装配工艺:端子需使用MOLEX专用压接钳(如11-03-0050)压接,压接后插入胶壳需听到卡勾锁定声,确保安装到位;
  4. 防呆确认:装配前检查胶壳与端子/针座的定位键是否对齐,避免插反导致电路短路或设备损坏。

六、合规与认证

本产品符合多项国际标准:

  • 安全认证:UL94V-0阻燃认证(UL文件号E123456);
  • 环保认证:RoHS 2.0(2011/65/EU)、REACH(SVHC清单),无铅、无镉等有害物质;
  • 行业认证:符合IPC-A-610电子组件装配标准,适配电子制造行业规范。

本产品以高集成度、宽温域、阻燃安全为核心优势,是消费电子、汽车、工业等领域小功率电路连接的优选方案。

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