WMSIC Electronic Components

MOLEX 430200400

Model430200400
PackageP=3mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MOLEX 430200400
Type
MOLEX
Minimum package
2500

Technical parameters

Electronic Component
MOLEX
Electronic Component
430200400
Electronic Component
1
Package
P=3mm
Electronic Component
2
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
3mm
Electronic Component
0.677g
Electronic Component
3mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
Micro-Fit(MX 3.0)
Electronic Component
BM0265576207
Electronic Component
PA
Operating Temperature
40℃~+105℃
Socket
2x2P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 430200400 连接器产品概述

一、产品基本属性与定位

MOLEX 430200400属于Micro-Fit™ 3.0系列(MX 3.0) 胶壳,是一款专为线对板/线对线连接设计的小间距通用连接器。其核心基础参数明确:

  • 插孔布局:2排×2PIN(2x2P),中心间距与行距均为3mm,符合Micro-Fit系列标准化设计;
  • 结构特征:黑色塑料外壳,带防退翅设计(增强PCB安装稳定性),无机械锁扣;
  • 品牌与适配:MOLEX原厂产品,封装中心距P=3mm,可匹配同系列端子(如43030系列压接端子)及PCB针座(如43025系列)。

该产品定位为高密度、小空间适配的通用连接方案,可满足多行业对紧凑集成的需求。

二、核心设计与材质特性

(一)结构设计细节

  1. 紧凑布局:2x2P的双排布局搭配3mm间距,在最小化占用空间的同时,实现4路信号/电源的可靠传输,适合设备内部紧凑区域(如PCB边缘、小型模块接口);
  2. 带翅固定:外壳两侧内置防退翅,安装于PCB时可嵌入焊盘,有效防止插拔过程中胶壳脱落,提升连接稳定性;
  3. 无锁扣设计:虽无机械锁扣,但依赖Micro-Fit系列端子的弹性接触倒刺结构实现可靠保持力,兼顾插拔便捷性与成本控制。

(二)材质与环境耐受性

  1. 塑料主体:采用聚酰胺(PA) 材质,具备优异的耐化学性、耐油性及机械强度,可承受频繁插拔;
  2. 阻燃等级:符合UL94V-0阻燃标准,遇火时快速自熄,降低火灾风险,适合对防火要求严格的场景;
  3. 宽温范围:工作温度覆盖**-40℃至+105℃**,可适应低温环境(户外设备、工业冷库)及高温环境(汽车舱内、工业控制器内部)。

三、适配场景与使用范围

MOLEX 430200400的设计特性使其适配多行业典型场景:

  1. 工业控制:小型PLC模块、传感器接口、伺服驱动器的内部连接——宽温耐受应对现场温度波动,阻燃V0满足厂房防火要求;
  2. 医疗设备:便携式仪器(血糖监测仪、小型输液泵)的模块连接——紧凑布局适配设备小型化,PA材质耐消毒清洁;
  3. 消费电子:智能音箱、小型路由器、充电器的内部排线——无锁扣简化装配,3mm间距满足高密度集成;
  4. 汽车电子:车载小型传感器(胎压监测、车内摄像头)连接——宽温范围适配车载环境(-40℃至85℃)。

四、性能优势与市场价值

  1. 空间效率:3mm间距比传统5mm间距节省约40%安装空间,助力设备小型化;
  2. 可靠性:PA材质机械强度+端子弹性接触,保证≥500次插拔使用寿命(Micro-Fit系列标准);
  3. 成本可控:无锁扣结构降低模具成本,带翅设计提升安装可靠性,平衡性能与成本;
  4. 供应链成熟:作为MOLEX成熟产品,货源稳定,适配同系列端子/针座,缩短研发周期。

五、安装与使用注意事项

  1. 端子适配:需搭配Micro-Fit专用压接端子(如43030-0001),避免非原厂端子导致接触不良;
  2. PCB设计:预留与带翅匹配的焊盘,确保胶壳固定牢固;
  3. 插拔规范:垂直于胶壳方向施力,避免端子弯曲或胶壳损坏;
  4. 环境限制:避免长期暴露于强酸碱环境(PA材质虽耐化学,但强腐蚀需额外防护)。

该产品凭借紧凑设计、宽温耐受及成熟供应链,成为多行业小空间连接的优选方案。

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