WMSIC Electronic Components

MOLEX 5025780300

Model5025780300
PackageP=1.5mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
MOLEX 5025780300
Type
MOLEX
Unit
Electronic Component
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5025780300
Electronic Component
1
Package
P=1.5mm
Electronic Component
0.239g
Electronic Component
1
Electronic Component
BM0265106299
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 5025780300 1.5mm间距带锁扣胶壳产品概述

MOLEX 5025780300是一款专为高密度连接设计的线对板/线对线胶壳,属于MOLEX经典小间距连接器系列,以1.5mm中心距、带锁扣防脱结构为核心特点,适配多场景下的低压信号与小功率传输需求。

一、产品核心身份与定位

该产品为单排3PIN(1×3P)胶壳,明确属于线对板/线对线连接组件范畴,是MOLEX针对紧凑空间内连接需求开发的标准化配件。其核心定位是「高可靠性、小体积、宽温适应」,可满足消费电子、工业控制等领域对高密度连接的轻量化需求,同时通过阻燃与锁扣设计保障安全性能。

二、关键物理与结构参数

  1. 间距与PIN数:中心距1.5mm,单排3PIN设计,符合小间距连接器的高密度布线要求,可有效缩小产品整体尺寸,适配小型化电子设备;
  2. 结构特性:带按压式锁扣(行业常规防脱设计),可实现与对应端子/针座的可靠卡扣,防止振动、冲击导致的连接松脱;不带翅设计,无额外定位柱,依赖端子或配合件实现安装定位;
  3. 外观与尺寸:白色PBT塑料外壳,视觉辨识度高,同时满足绝缘需求;

三、材料特性与环境适应性

  1. 塑料材质:采用PBT(聚对苯二甲酸丁二醇酯),具备优异的机械强度、耐化学性与尺寸稳定性,可抵抗日常使用中的轻微碰撞与弱溶剂侵蚀;
  2. 阻燃性能:符合UL94V-0最高阻燃等级,遇火时可快速自熄(燃烧时间≤10秒,无滴落物),有效降低火灾风险,满足电子设备的安全标准;
  3. 温度范围:工作温度覆盖**-40℃至+105℃**,可适应低温环境(如北方户外小型设备)与高温工况(如密闭空间内的微型模块),宽温性能稳定;

四、电气性能基础

作为连接器外壳,该胶壳不直接参与电气接触,但通过绝缘隔离保障连接可靠性:

  1. 绝缘性能:相邻端子间绝缘电阻≥1000MΩ(常规测试条件下),可有效防止短路;
  2. 适配电流:搭配MOLEX同系列端子(如502579系列)时,额定电流通常为1A(22AWG线径下),满足低压信号(如传感器数据)与小功率电源(如5V/12V)传输;
  3. 电压等级:额定电压50V AC/DC,符合一般低压电子设备的电气要求;

五、典型应用场景

  1. 消费电子:小型智能穿戴设备(如智能手环、蓝牙耳机充电盒)、便携式家电(如迷你加湿器、电动牙刷)的内部连接;
  2. 工业控制:小型PLC模块、传感器节点(如温度/湿度传感器)、微型执行器的信号传输;
  3. 汽车电子:车载非关键系统(如氛围灯控制器、胎压监测接收器)的辅助连接(需确认符合车载EMC要求);
  4. 医疗设备:小型诊断仪器(如血糖仪、血压计)的内部电路连接,依赖其阻燃与宽温特性;

六、搭配与使用注意事项

  1. 兼容组件:需搭配MOLEX同系列端子(502579系列)与针座(502580系列)使用,确保机械卡扣与电气接触匹配,避免非原厂配件导致的性能下降;
  2. 安装要点:带锁扣安装时需确认卡扣完全「咔嗒」啮合,防止虚接;不带翅设计需通过端子固定或板端定位孔实现安装,避免胶壳移位;
  3. 环境限制:避免长期接触强腐蚀性化学品(如浓酸、强碱),防止PBT材质老化;工作温度不可超过105℃,否则可能导致外壳变形;
  4. 手工操作:1.5mm间距较窄,手工焊接时需注意烙铁头尺寸(建议≤1mm),避免短路相邻端子;

七、总结

MOLEX 5025780300以小间距、带锁扣、宽温阻燃为核心优势,是紧凑空间内低压连接的可靠选择。其标准化设计与原厂兼容性,可降低设计与生产难度,广泛适配多行业的小型电子设备需求,尤其适合对体积、可靠性有严格要求的场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.