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MOLEX 5025780600
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- MOLEX 5025780600
- Type
- MOLEX
- Unit
- Electronic Component
- Minimum package
- 500 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 5025780600
- Electronic Component
- 1
- Package
- P=1.5mm
- Electronic Component
- (Wire-to-Board / Wire-to-Wire)
- Electronic Component
- 0.36g
- Electronic Component
- 1
- Electronic Component
- BM0265837165
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MOLEX 5025780600 线对板/线对线胶壳产品概述
一、核心基础参数梳理
MOLEX 5025780600是一款紧凑型线对板/线对线连接器胶壳，核心参数精准适配小型化电子系统需求：引脚配置为1排6针（1×6P），针脚中心间距仅1.5mm，排数1、每排PIN数6，外壳为白色。塑料主体采用PBT（聚对苯二甲酸丁二醇酯） 材质，工作温度范围覆盖**-40℃至+105℃**，可满足宽温环境下的稳定连接。作为胶壳组件，其核心功能是配合对应端子实现导线与电路板、或导线之间的信号/电力传输，是电子设备内部布线的基础组件之一。
二、设计与材质特性
该胶壳的设计聚焦紧凑性与环境耐受性：
- 1.5mm间距设计大幅缩小了连接器占用空间，适合对尺寸敏感的消费电子、小型工业设备等场景，可有效优化电路板布局；
- PBT材质具备优异的机械强度、耐化学腐蚀性及高温稳定性：既保证了胶壳注塑成型的精度（适配自动化生产），又能抵抗环境应力（如湿度、轻微溶剂接触），避免因受潮导致绝缘性能下降；
- 白色外壳便于视觉识别，同时PBT的低吸水性特性可减少长期使用中的性能衰减，提升产品可靠性。
三、适用场景与市场定位
MOLEX 5025780600的参数特性使其适配多领域应用：
- 消费电子：智能手机、平板电脑、智能穿戴设备的内部信号连接，利用紧凑尺寸适配设备小型化趋势；
- 工业控制：小型PLC、传感器模块的线对板连接，宽温范围满足工业现场的温度波动（如车间-20℃至+85℃环境）；
- 通信终端：小型路由器、IoT网关的内部布线，稳定传输低功率信号；
- 车载辅助系统：车载小型控制器（如胎压监测模块）的辅助连接（温区覆盖符合部分车载应用需求）。
其定位为高性价比紧凑型组件，兼顾性能与成本，适合中低端到中端电子设备的批量应用。
四、可靠性与环境适应性
从可靠性维度看，该胶壳具备以下优势：
- 插拔寿命：配合MOLEX专用端子（如502578系列端子）可实现数百次稳定插拔（参考官方 datasheet），满足设备生命周期内的维护需求；
- 温湿度耐受：-40℃~+105℃的工作范围覆盖绝大多数民用、工业场景，无需额外散热/防护即可稳定工作；
- 绝缘性能：PBT材质的绝缘电阻符合行业标准，可有效防止信号串扰或短路，保障传输质量。
五、安装与兼容性说明
该胶壳的安装方式适配常规线对板/线对线连接：
- 需配合对应规格的压接端子使用（如MOLEX 502578系列端子），端子压接导线后装入胶壳，再与电路板插座（或另一胶壳的端子）对接；
- 兼容性仅针对MOLEX同系列组件，非同系列产品可能存在尺寸/引脚匹配问题，建议配套使用官方推荐配件；
- 安装无需特殊工具，人工或自动化装配均可实现，适合批量生产效率需求。
综上，MOLEX 5025780600胶壳以紧凑尺寸、宽温耐受、高性价比为核心优势，是小型电子设备内部连接的可靠选择。
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