WMSIC Electronic Components

MOLEX 534260510

Model534260510
PackageP=2.5mm
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MOLEX 534260510
Type
MOLEX
Minimum package
150 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
534260510
Electronic Component
1
Package
P=2.5mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.75g
Electronic Component
2.5mm
Electronic Component
Electronic Component
PIN
5P
Electronic Component
1
Electronic Component
BM0265675287
Electronic Component
Electronic Component
Operating Temperature
55℃~+105℃
Pin
1x5P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 534260510 线对板针座产品概述

一、核心规格参数

MOLEX 534260510为单排线对板针座,核心规格适配中小功率电路的紧凑连接需求:

  • 针脚配置:1排×5针(总PIN数5),针间距2.5mm(公制标准间距,兼容常见PCB焊盘设计);
  • 安装方式:弯插式(引脚90°弯折,适配PCB侧面/垂直空间受限布局);
  • 电气额定值:额定电流3A(持续工作电流)、额定电压250V(AC/DC通用);
  • 材质镀层:触头采用磷青铜(高弹性、耐磨损),表面镀锡(焊接性优异、抗氧化);
  • 环境安全:工作温度-55℃~+105℃(宽温覆盖),塑料外壳阻燃等级UL94V-0,颜色为白色(便于安装识别)。

二、结构设计特点

该针座结构兼顾可靠性与安装灵活性:

  1. 弯插引脚:引脚向侧面弯折,可实现PCB垂直/侧面连接,有效节省正面空间,适合小型设备(如便携式电子、小型控制器);
  2. 磷青铜触头:材料弹性模量稳定,插拔时保持持续接触压力,减少接触电阻波动,提升信号/电流传输可靠性;
  3. 锡镀层工艺:镀层厚度均匀,既保证与导线端子的良好接触,又降低焊接虚焊风险,避免长期氧化;
  4. UL94V-0外壳:塑料外壳阻燃性能优异,意外短路或高温下可延缓燃烧,提升设备安全性。

三、电气性能表现

满足中小功率电路的常规需求:

  • 电流承载:额定3A持续电流,支持小型电机、传感器供电、低压信号传输(瞬时峰值电流建议不超1.5倍额定值);
  • 电压耐受:250V额定电压符合低压电气规范,适配12V/24V/48V等常见电源系统;
  • 接触可靠性:磷青铜弹性+锡镀层低接触电阻(<20mΩ),长期使用无明显接触不良,信号无延迟衰减。

四、环境适应性

宽温与阻燃特性适配多场景:

  • 温度范围:-55℃~+105℃覆盖工业(户外控制柜)、汽车辅助系统(车内模块)、消费电子(高温小家电)等环境;
  • 耐候性:UL94V-0阻燃外壳可应对高温风险,塑料具备一定耐化学腐蚀能力(如工业清洁剂),延长使用寿命。

五、典型应用场景

因结构紧凑、性能可靠,广泛用于:

  1. 消费电子:机顶盒、路由器、便携式音箱的内部电源/信号连接;
  2. 小型家电:咖啡机、加湿器、空气净化器的控制板与传感器/执行器连接;
  3. 工业控制:小型PLC、传感器模块、低压配电单元的线对板连接;
  4. 汽车电子:车载辅助系统(倒车雷达、氛围灯控制器)的内部连接。

六、选型与使用注意

  1. 选型匹配:确认PCB焊盘间距2.5mm、安装方向为弯插(避免与直插混淆);
  2. 参数确认:应用持续电流≤3A、电压≤250V,避免过载;
  3. 焊接工艺:锡焊温度260℃±10℃,焊接时间<3秒,防止损坏塑料外壳。

该产品依托MOLEX的工艺稳定性,在紧凑空间、宽温环境下的线对板连接场景中表现可靠,是中小功率设备的优选连接组件。

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