WMSIC Electronic Components

MOLEX 643221019

Model643221019
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
MOLEX 643221019
Type
MOLEX
Minimum package
12000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
643221019
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.15g
Electronic Component
1
Electronic Component
BM0265005318
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
12000
Electronic Component
0.22~0.44
(OD)
1.15mm~1.4mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOLEX 643221019 压接触头产品概述

MOLEX 643221019是一款专为21-24AWG线缆设计的压接式触头,属于ST Cable Mount系列,采用卷轴包装,广泛应用于低压电路的线束连接场景。作为MOLEX旗下的通用型触头产品,其在成本控制、安装效率与接触可靠性上实现了平衡,是电子设备内部线束连接的常用选择。

一、产品核心身份与应用定位

643221019属于压接型无焊触头,无需焊接即可实现线缆与触头的可靠连接,适合自动化装配线的批量生产。其定位为低压通用型触头,覆盖21-24AWG线规(对应导体截面积0.22~0.44mm²),主要用于消费电子、工业控制、小型汽车辅助系统等场景的内部线束连接,不涉及高压或大电流应用。

二、关键电气与物理参数详解

该触头的核心参数直接决定了其适配性与应用范围,具体如下:

  1. 线规适配:支持21-24AWG圆形线缆(对应导体截面积0.22~0.44mm²),覆盖小型电子设备中最常用的线缆规格;
  2. 绝缘外径限制:仅适配绝缘外径1.15mm~1.4mm的线缆,确保绝缘层不会过粗导致压接变形,或过细导致线缆定位不稳;
  3. 额定电压:250V AC/DC,符合12V、24V、110V等一般低压电路的电压要求;
  4. 包装形式:卷轴(Reel)包装,每卷通常为1000个标准规格,适合自动化压接机连续供料,减少人工换料时间。

三、触头设计与材料特性

触头的材料与结构是保证连接可靠性的核心:

  1. 触头材质:采用磷青铜(Phosphor Bronze),兼具良好弹性(压接后保持稳定接触压力)、抗疲劳性(长期使用不易变形)与导电性(降低接触电阻);
  2. 表面镀层:触头表面镀锡(Tin),优势包括:① 防止磷青铜氧化,延长寿命;② 降低接触电阻,提升电气性能;③ 成本远低于镀金/银,适合大规模应用;
  3. 压接结构:采用开放式压接设计(需配合对应工具),确保导体完全被包裹,压接后无虚接、松脱风险,且无需加热,避免焊接对绝缘层的损伤。

四、适配线缆与安装要求

  1. 适配线缆类型:兼容PVC、XLPE等常见绝缘材料的圆形线缆,需满足线规21-24AWG、绝缘OD1.15~1.4mm;
  2. 安装工具:需使用MOLEX配套压接钳(手动)或自动化压接机,确保压接区压缩比符合标准(导体区70%80%,绝缘区60%70%);
  3. 线缆预处理:剥线长度控制在1.2~1.5mm(参考官方手册),确保导体完全进入触头导体区,绝缘层刚好进入绝缘区,避免外露或错位。

五、典型应用场景

643221019适合以下低压连接场景:

  1. 消费电子:小型家电(加湿器、榨汁机)内部线束、数码产品(蓝牙耳机、移动电源)充电线束;
  2. 工业控制:小型传感器(温度、压力)信号线束、PLC输入输出模块低压连接;
  3. 汽车电子:辅助系统(倒车雷达、氛围灯)低压线束(不适用高压系统);
  4. 通信设备:小型路由器、交换机内部电源与信号线束;
  5. 医疗设备:小型诊断仪器(血糖仪、血压计)内部低压线束(需确认医疗认证,MOLEX部分产品具备该资质)。

六、产品优势与价值

  1. 成本可控:磷青铜+镀锡组合,成本比镀金触头低30%以上,适合大规模量产;
  2. 安装高效:卷轴包装+压接工艺,自动化装配速度达每秒1~2个,人工成本仅为焊接的1/3;
  3. 可靠性稳定:磷青铜弹性确保接触压力长期稳定,镀锡防腐蚀,压接工艺避免虚焊,寿命可达10年以上;
  4. 适配性广:线规与绝缘OD范围覆盖90%以上小型低压线缆,减少选型复杂度;
  5. 品牌保障:MOLEX严格品控,批量不良率低于0.1%,降低售后成本。

需注意:643221019不适合大电流(>5A)或高压(>250V)应用,选型需结合电路参数确认。详细尺寸与认证可参考MOLEX官方手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.