WMSIC Electronic Components

MOLEX 5016471000

Model5016471000
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MOLEX 5016471000
Type
MOLEX
Unit
Electronic Component
Minimum package
16000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
5016471000
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
1.042g
Electronic Component
1
Electronic Component
BM0034729393
AWG
22~26
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
16000
Electronic Component
0.124~0.34

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:Molex iGrid 501647-1000

1. 概述

Molex iGrid 501647-1000 是一个高质量的连接器解决方案,专为需要高效电气连接的现代电子设备而设计。作为一种压接插口,它提供了安全、可靠的电气连接,适用于广泛的应用场景,例如消费电子、工业设备、医疗设备及汽车电子等。

2. 制造商与系列

  • 制造商: Molex是一家全球领先的连接器和电子元件制造商,以其创新的产品设计和卓越的制造工艺而闻名。iGrid系列是Molex的一项高-performance系列,旨在提供灵活的解决方案以满足不同客户的需求。

3. 基本参数

  • 包装: 该产品采用卷带(TR)包装,这种包装方式有助于提高生产效率,使得在表面贴装(SMT)时,元器件的取用更为方便,减少了生产过程中的停机时间。
  • 零件状态: 该产品为有源器件,确保在使用时提供稳定的电流和信号传输,适合对稳定性要求较高的应用场景。
  • 插针或插口: 501647-1000为插口设计,能够容纳相应的插头,从而实现快速、易于连接和断开的电气接触。
  • 触头端接: 使用压接技术的端接方式确保了信号和电流传输的高可靠性,压接接头可以有效地防止因过度拉扯或振动导致的连接松动。
  • 线规: 该连接器支持22-26 AWG的线规,适应性强,能满足多种电线规格需求。
  • 触头表面处理: 采用锡表面处理,提供良好的导电性能和抗腐蚀能力,保证了长期的稳定性和可靠性。

4. 应用领域

Molex 501647-1000 适用于多个行业,尤其是:

  • 消费电子: 包括智能手机、平板电脑、个人电脑及其他数字设备,提供高效的电源和信号传输。
  • 工业设备: 在自动化设备和传感器中使用,确保可靠的连接以支持高性能操作。
  • 医疗设备: 在各种医疗仪器中,为电源和数据传输提供稳定连接,确保设备的可靠性和安全性。
  • 汽车电子: 在现代汽车电子系统中,支持多种功能,包括动力系统、车载信息娱乐以及安全系统。

5. 优势特点

  • 高稳定性: Molex的压接技术确保了连接的稳定性,即使在振动和高温环境中也能保持良好的性能。
  • 易于使用: 卷带的包装方式使得在自动化生产线上更容易进行装配,提高了生产效率。
  • 设计灵活性: 广泛的线规适应性使得该连接器能够轻松与多种电缆和组件配合,提供高灵活性的设计选择。

6. 总结

Molex iGrid 501647-1000 是一款精心设计的连接器,旨在适应现代电子设备的需求。其卓越的电气性能、可靠的压接设计和广泛的应用适用性使其成为高要求应用的理想选择。无论是在复杂的工业应用还是日常的消费电子产品中,Molex 501647-1000都能提供卓越的连接解决方案,为用户带来更高的性能和效率。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.