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MOLEX 502128000
Configuration
1 options
Configuration
20+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MOLEX 502128000
- Type
- MOLEX
- Minimum package
- 12000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MOLEX
- Electronic Component
- 502128000
- Electronic Component
- 1
- Electronic Component
- Terminal Block
- Electronic Component
- 0.144g
- Electronic Component
- 1
- Electronic Component
- Micro-Latch(MX 2.0)
- Electronic Component
- BM0000002494
- AWG
- 24~30
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 12000
- (OD)
- 1.4mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：Molex 50212系列 DuraClik™ Micro-Latch™ Mi II™ 502128000
概述
Molex 502128000 是 DuraClik™ Micro-Latch™ Mi II™ 系列中的一种高性能母压接触头，适用于24 AWG的导线。这款产品以其出色的接触性能、优良的耐久性和多用途的适应性，成为各种电子设备中关键连接应用的理想选择。Molex 一直以来致力于推出创新的连接解决方案，而50212系列则代表着其在微型连接器领域的卓越工程技术和设计理念。
主要特性
高品质依赖性：502128000的触芯采用镀锡材料，具备优良的导电性能和耐腐蚀能力，以确保长时间的可靠使用。镀锡设计不仅提供了良好的电气连接，还可以防止氧化，提高了接触性能和耐用性。
压接设计：该产品采用压接方式，提供简便且可靠的连接解决方案。压接技术能够实现高密度的连接，而不牺牲电气性能，适合于高空间紧凑的应用环境。
适用导线规格：502128000适用于24 AWG的导线，能够支持各种不同的连接要求。其广泛的兼容性使得其适用于多种类型的工业和消费电子设备中。
封装形式：产品以卷带形式（ReeL）封装，便于自动化生产流程中的快速组装和实施。这一封装方式提高了电子制造的效率，降低了生产成本。
耐久性和高插拔次数：该系列连接器设计的耐用性，适合需要频繁插拔的应用场景。能够承受多次插拔而不损失性能，是提升设备可靠性的关键因素。
应用场景
Molex 502128000广泛应用于多种电子设备中，尤其是在对空间和性能要求苛刻的领域，例如：
- 消费电子：如智能手机、平板电脑和可穿戴设备等，502128000能够提供可靠的电源和信号连接。
- 工业设备：在制造和自动化设备中，耐用的连接设计确保了设备可靠运行。
- 汽车电子：现代汽车中大量的电子组件需要高效的连接，502128000的耐高温和耐振动特性使其非常适合汽车应用。
- 医疗设备：在要求严格的医疗设备中，502128000能够提供高可靠性的连接，确保设备的精确性能和安全性。
结论
Molex 502128000作为DuraClik™ Micro-Latch™ Mi II™系列的一部分，凭借其优越的设计和技术特点，满足了现代电子产品日益增长的性能与可靠性需求。无论是在消费电子、工业应用，还是在汽车和医疗设备等领域，502128000都展示了其多功能性和卓越的电气性能，为电子设备提供了理想的连接解决方案。Molex继续致力于推动连接技术的创新和发展，为行业带来新的标准与应用，502128000正是这种承诺的体现。
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