WMSIC Electronic Components

MOLEX 53261-0371

Model53261-0371
PackageReel
BrandMOLEX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
MOLEX 53261-0371
Type
MOLEX
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MOLEX
Electronic Component
53261-0371
Electronic Component
1
Package
Reel
Electronic Component
Wire-to-Board
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0093052530
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MOLEX 53261-0371 PicoBlade PCB Header

概述

MOLEX 53261-0371是一款高性能、可靠的PicoBlade PCB连接器,主要用于连接电路板,充分满足现代工业、消费电子及通信设备等领域的需求。该连接器设计精巧,具有1.25mm的引脚间距和单排右角设计,使其在紧凑空间中依然具备出色的适应性。这种类型的连接器广泛应用于无源和有源设备的接入点,是实现电气连接和信号传输的关键组成部分。

设计与构造

53261-0371连接器采用表面贴装(SMD)技术,能够轻松集成到各种电路板上。它的右角设计允许在有限空间内进行连接,从而提高了设计的灵活性。此外,该产品的引脚以及外壳均采用镀锡(Sn)表面处理,具备良好的耐腐蚀性和导电性,确保了长期使用的可靠性和稳定性。连接器提供3个极点,使得在同一位置可以实现多路信号的高效连接。

应用场景

MOLEX 53261-0371适合于多种行业应用,包括:

  1. 消费电子:如智能手机、平板电脑和便携式设备,连接器可用于电池连接、数据传输等部件。
  2. 工业自动化:在各种传感器、执行器和控制系统中,用于信号的传递和电源的连接。
  3. 通信设备:如路由器、交换机、基站,以及无线设备中,对于接口的高密度要求是其设计的主要驱动力之一。
  4. 汽车电子:在车载电子系统中用于连接控制单元、传感器和执行机构,确保信号的快速传输。

特点与优势

  • 紧凑设计:1.25mm的引脚间距允许运用在空间受限的电路板上。
  • 高耐久性:经过镀锡处理,增加了连接器的耐腐蚀性和耐磨性,确保长时间的可靠工作。
  • 便捷的连接方式:采用摩擦锁设计,提供稳固的插拔连接,可以减少因振动导致的接触不良。
  • 控制简便:以卷带(Tape and Reel)形式包装,便于自动化装配,提高生产效率。

兼容性与兼容产品

53261-0371连接器与MOLEX的多款连接器系列兼容,包括通用的PicoBlade系列,用户可以根据具体需求灵活选择。同时,该连接器能够与其他品牌的相同规格配件互换使用。

结论

总而言之,MOLEX 53261-0371 PicoBlade PCB Header以其优越的设计、耐久性和多样化的应用场景,成为现代电子设备中不可或缺的一部分。无论是在消费电子、工业自动化还是通讯技术领域,这款连接器都表现出色,为设备性能和效率提供了强有力的支持。选择MOLEX 53261-0371连接器,将为用户的产品设计与开发带来前所未有的可靠性与便利性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.